Article Highlights
Predicting a ‘Roaring Twenties’ Innovation Boom
02/24/2021 | Hailey Lynne McKeefy, Freelance Journalist and Supply Chain Specialist
Quality and Continuous Improvement
02/24/2021 | Patrick Valentine, UYEMURA USA
Functional Inkjet Printing in PCB Manufacture
02/23/2021 | Pete Starkey, I-Connect007
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
02/19/2021 | Nolan Johnson, I-Connect007
The Benefits of Statistical Process Control
02/17/2021 | Kurt Palmer, Bürkle North America

Latest Articles

Finding Process Improvement Opportunities in Training

Nolan Johnson speaks with Leo Lambert of EPTAC about training the next generation out of high school and vocational schools, and how his company continues to improve processes, grow and adapt to changing requirements while fulfilling its mission to deliver technical certification training.

Predicting a ‘Roaring Twenties’ Innovation Boom

The 2020s have not started as anyone would have wished. The COVID-19 pandemic has exposed weaknesses in supply chains and in global manufacturing, yet this could still be the most innovative decade ever.

Quality and Continuous Improvement

The concern for quality control and reduced product variation can be traced back centuries. Archaic quality control methods were used by the Xia Dynasty in 2100 BC in ancient China. During the late 1290s in medieval Europe, guilds—the pre-cursor to unions—were responsible for product and service quality. From 1700 to 1900, product quality was determined by the individual craftsman’s efforts. At the close of the 19th century, Eli Whitney introduced standardized, interchangeable parts to simplify assembly.

Functional Inkjet Printing in PCB Manufacture

Pete Starkey speaks with Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands B.V., about advances in inkjet printing, even outside the lab.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

I’m following the landing procedures for NASA’s Perseverance Mars lander as I’m finishing my Top 5 list for the week. The successful landing of the lander seems a nice highlight for this week. Our global aerospace programs, both national and private enterprise, make these missions seem almost, almost routine. They are, as we all know, anything but routine. No surprise, then, that aerospace-related news percolated to the top of mind for our readers this week.

The Benefits of Statistical Process Control

The concepts of statistical process control were initially developed by Dr. Walter Shewhart of Bell Laboratories in the 1920s, and were expanded upon by Dr. W. Edwards Deming, who introduced SPC to Japanese industry after WWII. After early successful adoption by Japanese firms, SPC has now been incorporated by organizations around the world as a primary tool to improve product quality by reducing process variation.

Benchmarking With Your Suppliers: What to Know About Solder Mask

Everyone wants a smooth-running solder mask process with high productivity and minimal rejects, but to achieve this you really need a firm understanding of what your current process is capable of, what its limitations are, and what you want to improve. Process capability benchmarking is a great way to identify and implement improvements within your process.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

We’re moving on into 2021, and there’s quite a bit going on in the world of PCB design, fabrication, and assembly. IPC APEX EXPO is fast approaching, and I know a lot of you will be attending, albeit virtually. In this week’s Top Five, columnist Eric Camden provides a how-to guide for PCBA technologists planning their IPC APEX EXPO schedule.

USPAE Launches $42M DoD Consortium

The I-Connect007 editorial team recently interviewed Chris Peters, Kevin Sweeney and Shane Whiteside, members of the U.S. Partnership for Assured Electronics (USPAE), about the award the association received from the Department of Defense to create the Defense Electronics Consortium. In this conversation, they discuss the objectives of the consortium, which was created to help the government identify and address potential risks in the electronics industry.

Best Practices: Footprint Design and CAD Library Management

The I-Connect team spoke with Altium’s John Watson about the hurdles surrounding footprints and footprint design. John talks about how being proactive and improving the CAD library can better QC processes and help protect against footprint difficulties.


Joe Fjelstad's Book Review: The Innovators

"The Innovators: How a Group of Hackers, Geniuses, and Geeks Created the Digital Revolution" by Walter Isaacson is the best technology history book I have ever read, and at the same time one of the most engaging and entertaining. It is a forte of Isaacson to write biographies of great people. I have read his other books on DaVinci, Steve Jobs, Ben Franklin and Albert Einstein and found them equally brilliant. Isaacson has a number of other titles I have yet to get to in the future. He is a singularly great storyteller.

Orbotech Flex Equipment Introduction

Barry Matties speaks with Meny Gantz about the challenges for flex manufacturing, what’s driving the complexity around it, and how Orbotech’s new products will help their customers produce flex in much more effective way.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Another active news week in the electronics industry! February is launching with a high-G burn, to be sure. And if you’re a fan of The Expanse, like I am, then you’ve probably already watched through to the Season 5 finale; this means you have attention to spare for industry news all of a sudden. And if you haven’t reached the current end of the line for The Expanse, then today’s list is just what you need while you catch up.

Catching up With Nano Dimension

Dan Feinberg spoke with Valentin Storz, Nano Dimension’s general manager of EMEA and director of marketing, about how the pandemic has affected their business this past year and what they have planned moving forward.

Kemmer Praezision Partners with Insulectro

In this interview, Nolan Johnson and Gregor Dutkiewicz discuss Kemmer Praezision, their new working partnership with Insulectro, and some of the recent market challenges in mechanical drill bit technology.

Dan Feinberg's Favorite Career Moments

During a recent conversation on industry topics, Nolan Johnson asked Dan Feinberg, PCB fabrication pioneer, businessman and IPC Hall of Fame inductee, about his favorite career moments. In this clip, we proudly share with you two of Dan’s highlights. Both of these memories speak to Dan’s role as a trailblazer in electronics manufacturing—first in the U.S, then across the globe.

Making the Most of a Virtual Event

Nolan Johnson speaks with Alicia Balonek, senior director of tradeshows and events at IPC, about how both attendees and exhibitors can best prepare for this year’s virtual IPC APEX EXPO and breaks down some of the events you can look forward to at this year’s show.

Seven Tips for Your Next Stackup Design

Rarely do we have the luxury of designing a board just for connectivity. When interconnects are not transparent, we must engineer them to reduce the noise they can generate. This is where design for signal integrity, power integrity and EMC—collectively high-speed digital engineering—are so important. Eric Bogatin offers seven tips for stackup design.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, we have a variety of news and articles to share, and it’s all positive. We have a new president, and he’s pledging to help American businesses. December PCB sales were up 4.5% over the same period a year ago. Atotech is just about ready to launch an IPO. Sunstone has tweaked its free CAD tool, PCB123, to make it even easier for designers to receive their Gerber files. And columnist John Watson breaks down what we all learned during the chaos that was 2020.

Book Review: The Timeliest Read of 2021—The Business of We

It’s only January, but this may be the timeliest book of the year, as well as the most important. Why? Because it deals with the issues that we are facing right here now. The “gap” that Kriska refers to is the one between black and white, men and women and as the title suggests “we and them.”


IPC’s Alicia Balonek Talks Trade Show News

Nolan Johnson discusses IPC APEX EXPO 2021 with Alicia Balonek, senior director of trade shows and events at IPC. Alicia provides an update on how IPC APEX EXPO will be structured in a virtual format, overviews the programming changes, and new additions designed to make IPC APEX EXPO the best virtual event possible.

5 Keys to Smart Process Success

Smart factories require the core underlying processes to be connected and “talking” to generate the data necessary to make real-time process decisions, that is, the IIoT (Industrial Internet of Things). In a truly connected factory, an ongoing continuous dialog between machines, business processes, suppliers and customers is happening in the background. This dialog is not only interactive, but proactive, as a constant stream of real-time data is tweaking and adjusting processes to drive improvement. It also provides time-critical information on how processes are operating, supply chain pipeline, and delivery status updates—all based on data.

The Future of Imaging and Inkjet Printing

We recently spoke to Ed Carignan of Technica, who outlines the current landscape for both direct imaging and inkjet printing and describes how the technologies have evolved over the years. He also details what’s next on the horizon.

Book Excerpt: ‘Thermal Management: A Fabricator's Perspective,' Chapter 3

Conceptually, a metal-core board is exactly like it sounds—the metal is in the middle of the PCB sandwiched between layers on both sides. Just about any PCBA that will contain active heat-generating components can benefit when designed on a metal-core PCB. On a conventional PCB, the standard FR-4 layers are relatively poor thermal conductors, and heat is normally dissipated from active components using vias and thermal pads, as discussed earlier.

EIPC Technical Snapshot: Business Outlook

A headline in a Sunday newspaper had caught John Ling’s eye as he composed the invitation to this fourth EIPC seminar: “Now, more than ever, we need to talk.” Thus, it is that EIPC decided to run another technical webinar, which was just like one of their in-person conferences, except no one had to travel—or got to enjoy a beer or excellent food with convivial company.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week’s news gave off every indicator that we’ve started a new calendar year. The news channels were busy with changes in leadership—both corporate and governmental—and changes in ownership. Changes in representation, too. Honestly, it was hard to sort out the news to just five top items. Be that as it may, here are five things we think you ought to read, even if you read nothing else about the electronics manufacturing industry this week: tradeshow coverage, strategic acquisitions, market discussion, and governmental advocacy.

Tech 2 Tech: KYZEN’s Short Technical Sessions a Big Hit

Nolan Johnson gets an update from Tom Forsythe on KYZEN’s Tech 2 Tech sessions. These brief 15-minute sessions were set up during the pandemic by KYZEN for customers, prospects, and new engineers around cleaning, and have since found traction with their manufacturers, reps and distributors.

Your Greatest Competition is Yourself

It really doesn’t matter who you think your external competitors are, because the only competitor that really matters is you. Of course, you will look externally to stay on top of latest trends, but when it comes to competition, just competing with yourself is a win. When you look at yourself as your greatest competitor you will start with a huge advantage: you already have great intel on how “your competition” thinks. Ask yourself, “What can I do to displace my ‘competitor’ and create something much better?”

What’s Driving Price Increases for CCL and Prepreg?

Demand for copper foil is increasing from both PCB and battery production for e-mobility, leading to an upward price pressure for copper foils as post lockdown pent-up demand starts to exceed capacity. Lead times are stretching and prices increasing, particularly for heavy copper foils (2 oz./70 micron and above) as capacity is repurposed to maximize square-meter output for lightweight foils to increase capacity for lithium battery production.

Book Excerpt: Thermal Management With Insulated Metal Substrates, Part 5

The following is an excerpt from Chapter 5 of "The Printed Circuit Designer's Guide to... Thermal Management With Insulated Metal Substrates," written by Ventec International Group’s Didier Mauve and Ian Mayoh. In this free eBook, the authors provide PCB designers with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate laminates.


MivaTek’s New Technology and Market Drivers

I recently spoke with Brendan Hogan about the upcoming new product releases from MivaTek. The conversation flows naturally from the new product’s market drivers to the X=Xc – 1 idea that is at the core of the market drivers.

CES 2021 Coverage: A Virtual Show Floor

I write this on the final day of CES 2021, and I expect CES will never be the same. It will not revert back to what it once was. I also cannot imagine it stays a totally virtual show; in doing so, I feel it would fail. Does that mean I think the 2021 show was a failure? No, not at all. In fact, it was a very good event, particularly in light of the medical and political pandemic that we have been enduring.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Hard to believe that a year ago, I was getting ready to attend DesignCon and IPC APEX EXPO and wondering if this Novel Coronavirus was going to cut into attendance from the Pacific Rim. Now, we’re accustomed to virtual trade shows. They’re not ideal, but they’re the best we can do while meeting in person is not possible. We’ve learned to adapt.

Bruce Mahler Discusses Ohmega Technologies' Acquisition by Arcline Investment Management

I-Connect007’s Nolan Johnson catches up with Bruce Mahler, vice president and general manager at Ohmega Technologies, about Thursday’s announcement that Ohmega Technologies has been acquired by Arcline Investment Management. Mahler outlines the new opportunities this presents for Ohmega Technologies and discusses how this change in ownership will benefit existing customers and markets as well.

My View from CES 2021: Day 1

What a difference a year makes. One year ago, those of us who cover and attend CES were going from one press conference to the next; this year, we are at home going from link to link. Confusing and challenging, yes, but there are some advantages: no masks, only five steps to get to a restroom, being able to have three of four events or more displaying on your screens at the same time and being able to download press kits as needed. So far, many new devices are being introduced, but of course, they are all online, so you wonder if some of them really exist or are truly operational as yet.

TTM’s Approach to Stackup Design: Train the Customer

In this interview with the I-Connect007 Editorial Team, TTM’s Julie Ellis and Richard Dang drill down into stackup design, detailing some of the common stackup challenges that their customers face when designing for both prototype and volume levels, and offering advice to designers or engineers who are struggling with stackup issues. They also discuss why having too many different prepregs in a stackup can be asking for trouble, and how proper stackup design can optimize both the fabrication and assembly processes.

CES Dispatches: Opening Day at Pepcom

On Monday, January 11, I attended the launch of the CES 2021. Well, more precisely, I attended the Pepcom program, one of the multitude of ways to connect with CES in the virtual environment. Pepcom is a regular at CES, functioning a bit like a show-within-a-show.

CES 2021: Just How Different Will It Be?

CES 2021 starts today and this year there is no need for an overpriced hotel room in Vegas, no long lines to get a taxi or board a bus, and no crowded exhibit halls (one good thing this year). On the other hand, you must decide ahead of time what you want to see and make a reservation or appointment if you wish to have time and access assured.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s a new year, and time for new resolutions and new beginnings. “New year, new you” certainly is reflected in this past week’s news. We saw several announcements regarding mergers, acquisitions, and organizational changes, plus some government legislation to help kick off the new year. Based on viewing activity, readers were keen to keep up on the changes under way.

IPC CEO and President John Mitchell Discusses New Membership and Dues Structure

In this video, IPC CEO and President Dr. John Mitchell discusses the organization’s move from a site-based and enterprise membership dues structure to a company revenue-based model. Mitchell explains that this change will go into effect upon each member company’s renewal in 2021, and he points out that many of the existing member discounts will remain unchanged.


Whiteside’s View From the Summit: An Industry Perspective

I spoke with Shane Whiteside to get his unique perspective on the industry as president and CEO of Summit Interconnect, as well as his position on the board of directors for the IPC. Whiteside discusses the business challenges he sees overall.

I-Connect Editor’s Choice: Five Must-Reads for the Week

We always hear that the PCB industry is “mature,” full of people past their prime who don’t know how to change with the times. I think 2020 puts the lie to that idea. I’m honored to be a journalist covering such an amazing group of people. In the words of U2, “I will begin again.” Happy New Year!

I-Connect007 Wishes You a Happy New Year

Could there be a more welcome year in recent memory than 2021? If there’s one thing most of us can agree on, it’s that we want 2020 squarely in our rearview mirror as we speed ahead with a fresh, new start. This past year has brought with it much reflection, change and even some consternation. Thank you for taking this journey with us!

Pete Starkey Discusses a Favorite Career Moment

Andy Shaughnessy recently asked Pete Starkey to discuss one of his favorite moments from his long career. Pete’s reporting, as readers know very well, is masterful; Pete’s pen can capture all the feel and vibrancyy of a technical conference—and his readership numbers often top our charts. No wonder then, that Pete’s favorite moment includes something he wrote going “viral” with the help of the UK government.

Chapter 1 Excerpt: The Printed Circuit Assembler’s Guide to Process Validation

The original principle underlying the IPC’s ionic cleanliness requirement was that the mobility of surface ions, detectable from SIR measurements, would correlate to a maximum value of detectable ionic elements permissible on the circuit surface. The industry required a test that was both fast and accurate for process control. Thus, a simplified ion chromatograph that was able to detect ionic elements without differentiation was created.

Top 10 Most-Read PCB Articles of 2020

As 2020 comes to a close, the I-Connect007 Editorial Team takes a look back at its most read articles. Here are the top 10 reads in PCB from the past year.

Happy Holden Discusses His Favorite Career Moment

Managing Editor Nolan Johnson recently buttonholed Happy Holden and asked him to discuss the favorite moment of his career. To know Happy is to understand the full weight of his quiet influence on this industry. We’re delighted to share with you Happy’s reminiscence about spending time with his family at David Packard’s ranch while re-engineering the tank controls at the Monterey Bay Aquarium. As Happy explains, Packard may have been a billionaire and an ex-secretary of defense, but he still cleaned all of the fish that Happy’s kids caught on the ranch.

Millennials and Seasoned Veterans: Your Future Lies in Both

There is no doubt that we are having a crisis when it comes to the workforce in our industry today. In the PCB and PCBA industries, as well as most manufacturing industries, there is a definite shortage of good people we can hire. Dan Beaulieu describes how the future of the electronics manufacturing industry lies in both millennials and seasoned veterans alike.

EIPC Technical Snapshot: PCB Surface Finishes

For the third in a series of Technical Snapshot webinars, EIPC chose to focus on PCB surface finishes, comparing specific properties, examining corrosion behaviour and discussing selection criteria for low-loss, high frequency applications.

John Watson Discusses His Favorite Career Moments

As we celebrate the holidays after a tumultuous year, it’s important to remember all of the good things in our lives. In this short video, Altium’s John Watson discusses a few of the moments that really stand out in his career: earning his IPC Certified Interconnect Designer credentials and designing his very first circuit board.


Happy Holidays from I-Connect007

The I-Connect007 team would like to wish you and your loved ones the happiest holiday season. Continue to stay safe and healthy as we head into 2021. Happy Holidays!

Batteries and Data Centers

The I-Connect007 team met with electrical engineer Mike Mosman, who has spent the majority of his career designing some of the country’s largest data centers. Mike recently sold his engineering company CCG Facilities Integration; he is now the vice president of electrical engineering in mission-critical facilities for Morrison Hershfield, and is still designing leading-edge data centers for large Internet companies. In this discussion, Mike explains how evolving battery technology and a strong demand are playing a key role in this area and others.

IPC Addresses Critical Industry Skills Gaps With Electronics Workforce Training

Over the past three decades, IPC standards and certification programs have played a critical role in protecting public safety and promoting excellence by ensuring the quality, reliability, and consistency of electronic products. In 2019, IPC worked with its global network of certification centers to certify over 108,000 individuals across 200 countries and 21 languages to seven IPC standards. The ubiquitous adoption of these programs speaks to the strong partnership forged between IPC and the electronics industry.

Chapter 2 Excerpt from the Book ‘Thermal Management: A Fabricator's Perspective’

Insulated metal PCBs (IMPCB) or metal-clad PCBs (MCPCB) are a thermal management design that utilizes a layer of solid metal to dissipate the heat generated by the various components on the PCBs. When metal is attached to a PCB, the bonding material can either be thermally conductive but electrically isolative (IMPCBs or MCPCBs), or in the case of RF/microwave circuits, the bonding material may be both electrically and thermally conductive. The reason that RF designers usually have the bonding material thermally and electrically conductive is that they are using this not only as a heat sink but also as part of the ground layer. The design considerations are quite different for these different applications.

Prices of Copper-Clad Laminates Continue to Rise

Forces within and outside the PCB industry have led to concerns over rising prices for raw materials of copper-clad laminates (CCL). Recently, two major explosions at epoxy resin plants in China had a great impact on domestic resin suppliers. Prices have risen steadily in 2020, with leading CCL manufacturers announcing price increases of 20-30% recently. As the cost of raw materials such as electronic copper foil, resin and glass fiber have risen, the cost for manufacturing CCL has taken off as well.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Some years, the middle of December is marked by a distinct lack of news in PCB design, fabrication and assembly. Much of the industry often takes off around this time to get a head start on the holidays, or to squeeze in a much-needed vacation. But 2020 is not one of those years. Most of us aren’t traveling anywhere farther than the refrigerator this year, and everyone seems to still be working, albeit from their home offices. And companies in the PCB community continue to make news.

Ucamco Webinar Explores Benefits of Front-End Automation Tool

I have known the Ucamco people for over 30 years and recognise their company as an industry-leading provider of PCB CAM and pre-CAM software, as well as laser photoplotters and direct imaging systems. The team has always endeavoured to understand customer needs—often to anticipate them—and to respond with innovative solutions.

Dr. John Mitchell on IPC APEX EXPO Going Virtual

On Monday, December 14, 2020, Barry Matties and Dr. John Mitchell, IPC president and CEO, discussed last week’s decision to move IPC APEX EXPO to an all-virtual platform. In this interview, Dr. Mitchell confirms that IPC is committed to delivering a cutting-edge experience, including a strong technical program, exhibitor and visitor support, multiple keynotes and a wide variety of online networking events. Matties and Mitchell also analyze the challenges for IPC in hosting the show, as well as some of the unique opportunities that a virtual show presents for IPC and attendee alike.

This Month in PCB007 Magazine: Hiring Is an Investment in Your Business

Hiring is one of the most difficult processes in business. If you don’t get it right, you pay a heavy price. To get it right requires a well-defined process beyond just understanding the job description. It’s also important to understand the most important soft skill set you are looking for. For example, some of the most important skills may be the ability to solve problems, communicate well, organize tasks, and work with others.

Happy Holden: ECWC15 Virtual Event a Success

This is the first Electronic Circuits World Convention that I have not attended in person since 1978. To refresh your memory, these are held every three years on a rotating basis. The HKPCA hosted this year’s conference and they kept up the fine tradition of collecting outstanding keynotes, nearly 60 technical presentations and myriad poster papers. HKPCA was also kind enough to provide English slides and translations. It is still possible to sign up and view the presentations. I have listened to 20 of the presentations, and hope to attend even more in the coming days as they are all worth watching.


I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week’s mainstream news was dominated—well, my personalized online news feed was, at least—by ballistics. SpaceX was in the news daily for lobbing multiple pieces of iron, even as their CEO took his household suborbital, leaving California and touching down in Texas. Pandemic numbers charts continue their skyward trajectory worldwide. The ever-present military tests and technology demonstrations, seemed a bit more commonplace this week as well. Worldwide political news, in general, seemed to follow parabolic curves like an Australian boomerang, veering off in unexpected ways only to suddenly cut a curving path and return.

Book Excerpt: Thermal Management With Insulated Metal Substrates, Part 4

The following is an excerpt from Chapter 4 of "The Printed Circuit Designer's Guide to... Thermal Management With Insulated Metal Substrates," written by Ventec International Group’s Didier Mauve and Ian Mayoh. In this free eBook, the authors provide PCB designers with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate laminates.

Happy’s DIY Solution to Chemical Control

I confess. I am a control nerd and highly analytical. My second degree is in EE control theory, and I see the world in terms of feedback loops and black boxes. Early in my career, I was volunteered for the technical programs for the California Circuits Association (CCA), which was created by my mentor Clyde Coombs. In discussions with fellow process engineers, it was clear that the chemical process controls that HP could afford and allow me to put in place were not able to be duplicated by much smaller PWB shops.

Understanding MIL-PRF-31032, Part 6

Concluding this six-part discussion on understanding the military printed circuit board performance standard MIL-PRF-31032, Anaya Vardya the remaining procedure required to address the unique requirements of the military.

Pacothane on the Future of Laminate Technologies

Nolan Johnson recently spoke with the Pacothane Technologies team about the current drivers of circuit board technology and how that has influenced and increased their product development of lamination and lamination assist products.

Chapter 1 Excerpt from the Book ‘Thermal Management: A Fabricator's Perspective’

Heat cannot be efficiently exchanged with stagnant air surrounding a hot device; however, it can be transferred away from the electronic component to the PCB using thermal vias. A thermal via is a good conductor of heat that runs between the top layer and bottom layer of the PCB, dissipating heat through simple conduction. In simple terms, thermal vias are plated holes located under, or electrically connected to, a surface-mounted heat source on a PCB that allows heat transfer through the hole.

ECWC15 Virtual Conference Keynote: 5G PCB Technology and Material Challenges

The second day of the Electronic Circuits World Convention began with a keynote from Dr. Shiuh-Kao Chiang, managing partner of Prismark, describing the PCB technology and material challenges presented by the introduction of the fifth-generation cellular wireless communication network—the roll-out of which was continuing in spite of the coronavirus pandemic. Technical Editor Pete Starkey has more.

Lorain County Community College’s Successful MEMS Program

The I-Connect007 editorial team had the pleasure of an extended and detailed conversation with Johnny Vanderford and Courtney Tenhover from Lorain County Community College (LCCC). Vanderford and Tenhover are at the heart of the microelectromechanical systems (MEMS) program at LCCC that is emerging as a model for a successful technical higher-education program. This conversation was lively, and the enthusiasm at LCCC is infectious, as it should be; their results are impressive.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Around the holidays, we often see a slowdown in PCB design and manufacturing news. But this holiday season, there’s been no rest for the newsmakers in our industry! In the last week, our daily and weekly newsletters have been chock-full of breaking news and up-to-the-minute technical information that readers like you rely upon every day.

Just Ask Tara Dunn: The Exclusive Compilation

We asked for you to send in your questions for Averatek’s Tara Dunn, and you took us up on it! We know you all enjoyed reading these questions and answers, so we’ve compiled all of them into one article for easy reference. And if you’d like to hear more from Tara, be sure to view her Flex007 column series “Flex Talk.”


Stephen Chavez and Happy Holden on Designing Reliable Vias

Andy Shaughnessy and Happy Holden speak with Stephen Chavez, a staff engineer with an aerospace company and chairman of the Printed Circuit Engineering Association (PCEA), about designing vias for greater reliability. They also address several areas where they can look to improve reliability, a variety of steps that designers should take to help ensure more robust vias, and some testing and educational resources that PCB designers and design engineers should be aware of.

GreenSource Fabrication Creates Plating Flexibility

The I-Connect007 editorial team spoke with GreenSource Fabrication’s Alex Stepinski, VP and officer, and Rick Nichols, product engineer, about plating capabilities, new equipment developments, and how best to create more plating flexibility in a shop.

Use of IMS Thermal Materials in Multilayer Stackups for Power Applications

This roundtable discussion brings together the expertise of Ventec International Group’s Global Head of IMS Technology Chris Hanson and Technical Manager Denis McCarthy. Rax Ribadia of Excello Circuits provides hands-on fabrication experience from a specialist PCB manufacturer, and I-Connect007 editors Andy Shaughnessy and Pete Starkey contribute to a conversation that explores applications, materials, design considerations, and mechanisms of heat transfer.

Just Ask Tara Dunn: Will IC Substrates Be Produced in Volume in the U.S.?

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, John Mitchell, and others in our “Just Ask” series. Now, it’s Tara Dunn’s turn! Tara is the vice president of marketing and business development for Averatek. Today's question: Do you think IC substrates (BGA, CSP, flip chip, etc.) will ever be produced in high volumes in the U.S.?

EIPC Technical Snapshot: Market Analysis and Advanced Manufacturing Tech

Pete Starkey details the November EIPC webinar program that combined knowledgeable market analysis and advanced manufacturing technology, including insights from Prismark's Dr. Shiuh-Kao Chiang, Averatek's Mike Vinson, and Atotech's Roland Herold.
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