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In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
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I-Connect007 'Just Ask' Q&A Compilation Available Now
April 21, 2021 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
Throughout 2020, we asked you to send us your questions for Happy Holden, John Mitchell, Joe Fjelstad, Tara Dunn, and Heidi Barnes. You all had plenty of questions for these industry experts.
These five luminaries have seen it all. Happy, also known as "Mr. HDI," pioneered many of today's PCB design and fabrication processes while working at Hewlett-Packard. John Mitchell is president and CEO of IPC, and he co-founded the Alpine Electronics research company that introduced navigation systems into the U.S. Joe Fjelstad founded Silicon Pipe and Verdant Electronics, and he has over 185 patents issued or pending related to electronic interconnect and packaging technologies. Tara Dunn is the VP of marketing and business development for Averatek and founder of Omni PCB, and she specializes in additive processes, flex and rigid-flex, and RF/microwave applications. And Heidi Barnes is a signal integrity engineer with Keysight Technologies. She was named 2017 DesignCon Engineer of the Year, and Heidi also won NASA's coveted Silver Snoopy Award.
Click to download the Just Ask! Compilation.
And we're not resting on our laurels! For our next "Just Ask" series, PCB007 columnist Michael Carano is stepping up to answer your questions. Mike is a well-known expert on plating and wet processes in general, as well as co-chair of the IPC Technology Roadmap Executive Committee. To pose your questions for Mike, click here.
We also invite you to participate in the "Just Ask... Survey" to help answer the most important industry questions of the day. Regardless of your role in the industry, we welcome all questions relating to materials, testing, plating, chemistries, front-end, imaging, training, supply chain, hiring/recruiting, environmental or governmental issues—or any other topic. Ask as many questions as you like in this survey; there is no limit to the number of questions you ask or the number of times you can complete the survey.
We appreciate all of your questions, and our experts have enjoyed answering them as well. Thank you for your continued support.
Suggested Items
The New Industry: Will the Growth Continue?
04/30/2024 | I-Connect007 Editorial TeamHow sustainable are the primary financial models in the United States regarding PCB fabrication shops? In this interview with economic experts Shawn DuBravac and Tom Kastner, we explore what’s happening with U.S. printed circuit board shops in today’s market, how consolidation affects the industry, and what can be done.
TTM’s High Tech Expansion and Industry Innovation
04/30/2024 | Marcy LaRont, PCB007 MagazineTom Edman has been the CEO of TTM Technologies since 2014 and has an extensive background in electronics and manufacturing. TTM is a leading global manufacturer of technology solutions, including mission systems, RF component and RF microwave microelectronics assemblies, and quick turn and advanced technology printed circuit boards.
U.S. Companies Invest Heavily in Robots
04/30/2024 | IFRManufacturing companies in the United States have invested heavily in more automation: total installations of industrial robots rose by 12% and reached 44,303 units in 2023. Number one adopter is the car industry followed by the electrical and electronics sector.
USPAE to Springboard U.S. Technology Forward
04/30/2024 | Marcy LaRont, PCB007 MagazineThe U.S. Partnership for Assured Electronics (USPAE) was launched as a nonprofit subsidiary of IPC in 2020, specifically to manage the DoD relationship and access to funding, and to develop a cooperative facility to develop UHDI capabilities in the U.S., not only for the defense sector, but for the whole of the U.S. electronics industry. It is a tall order, but industry veteran Joe O'Neil believes it will happen. Having been tasked with making the UHDI Capable Cooperative Production Facility (UCCPF) a reality, he provides an update on this important project for U.S. electronics manufacturing.
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
04/29/2024 | Samsung ElectronicsSamsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.