-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
IPC Training Course on PCB Design for Military & Aerospace Applications
October 12, 2022 | IPCEstimated reading time: 1 minute
IPC will be holding a training course on printed circuit board (PCB) design for military and aerospace applications from October 18 to November 23, 2022.
This course addresses specific challenges encountered in military and aerospace applications, including the effects of vibration, shock, radiation, and altitude, extended operating temperature range, and other design considerations for high reliability applications. The class also focuses on the impact of these designs on manufacturing and assembly techniques, documentation, and manufacturing file generation.
Scheduled from 11:00 am to 1:00 pm every Tuesday and Thursday, the training course will be taught by an IPC-certified industry expert with over 25 years of experience in the field. The eight-week program utilizes interactive webinars, on-demand recorded class sessions, job-specific exercises, and team projects to facilitate mastery of the key concepts required to design boards for military and aerospace applications.
PCB Design for Military & Aerospace Applications is ideal for designers, engineers, technicians, and other individuals who want to acquire or increase their ability to meet the design, manufacturing, packaging, and routing challenges posed by military, aerospace, and space applications.
Before taking the course, participants are recommended to complete the PCB Fundamentals courses (I and 2), or be familiar with:
- Schematic symbol creation
- Schematic Generation
- Documentation and Dimensioning
- Standard Rigid Printed Board Design
For more information, click here.
Suggested Items
DDM Novastar Unveils Affordable NovaPlace Automatic Pick and Place Systems
05/06/2024 | DDM Novastar Inc.DDM Novastar, a prominent U.S. manufacturer specializing in SMT and PCB assembly equipment, proudly announces the recent launch of their NovaPlace Pick & Place systems. This new line introduces entry-level yet high-performance pick and place machines.
May Issue of SMT007 Magazine: Coming to Terms With AI
05/06/2024 | I-Connect007 Editorial TeamIn the May 2024 issue of SMT007 Magazine, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
Intel Takes Next Step Toward Building Scalable Silicon-Based Quantum Processors
05/02/2024 | BUSINESS WIRENature published an Intel research paper, “Probing single electrons across 300-mm spin qubit wafers,” demonstrating state-of-the-art uniformity, fidelity and measurement statistics of spin qubits.
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.