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E-Mobility a Driver of Topics at IPC APEX EXPO
December 9, 2022 | Sandy Gentry, IPCEstimated reading time: 1 minute
E-Mobility is a challenging new paradigm for electronics design. Regardless of industry, automotive, two-wheeler, vertical takeoff and landing (VTOL), rail, or marine, e-Mobility presents new challenges that the electronics supply chain is working together to resolve.
You can find the latest information on e-Mobility at several technical sessions at IPC APEX EXPO 2023.
The IPC APEX EXPO Technical Conference will host an engaging special session focused on e-Mobility touching on supply chain and technology issues. The e-Mobility Special Session includes speakers and panelists from Rivian. Overall, the technical conference offers many technical papers advising on assembly and design for high reliability. A few highlights include
- S02: EX 1- High Reliability for Extreme Environments 1 including a paper by Dr. Walter Olbrich, TTM Technologies, titled “Failure Characteristic of PCBs in Automotive EV Powertrain Applications and Solution Proposals to Improve Reliability and Robustness”
- S06: EX 2- High Reliability for Extreme Environments 2 with a presentation from Kennedy Fox, Reliability Failure Analysis Scientist, MacDermid Alpha Electronics Solutions
- S23 EM3-C&C Electronic Materials Cleaning and Coating 1 including a paper from Dr. Heiko Elsinger, Senior Expert, Robert Bosch GmbH on “Investigation of the Electrochemical Reliability of Conformal Coatings under High Voltage
- S25: QRTI-Assembly Risk Prediction and Failure Analysis including a paper, “Failure Analysis of High-Speed Cables Due to Molecular Degradation of Wire Insulation,” by Eric Campbell, Advisory Hardware Development Engineer, IBM Corporation
IPC standards development task groups will be diligently working to advance manufacturing and design standards in the areas of high voltage. The test methods task group will celebrate the release of the new test method for high voltage testing. Task groups of interest are the 7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum, 7-31FHV: IPC/WHMA-A-620 High-Voltage Cable Addendum Task Group, D-33AA: IPC-6012 Automotive Addendum, or 5-21M: Cold Joining/Press-fit Task Group.
Professional Development Workshops take place on Sunday, January 22, and Monday, January 23, including PD28: Press-fit Technology - Value Chain, Physics, Process and Standards which provides insight into the production, design, and application of compliant press-fit pins and components as well as new materials and surface finish technologies.
In addition, of interest to those electrifying and advancing systems within vehicles, IPC is hosting an E-Textiles Conference, collocated with IPC APEX EXPO on Sunday January 22.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/03/2024 | Nolan Johnson, I-Connect007This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.
IMI Welcomes New CEO
05/03/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI),The IMI Board of Directors announced, in a disclosure dated April 25, 2024, the appointment of Louis Sylvester Hughes, Chief Executive Officer (CEO).
Electronics Industry Sentiment Rose in April, Hitting New High
05/02/2024 | IPCApril 2024 marked the third consecutive month of sentiment growth among electronics manufacturers. When asked if they expected labor costs for hourly workers to rise over the next month, manufacturers in the United States, Mexico, and Europe predicted a five percent increase, while manufacturers in Asia predicted a slightly lower four percent increase.
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.