-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Hiring for Soft Skills in Technology
August 16, 2023 | Brian Wallace, HR Strategies NowEstimated reading time: 1 minute
In the age of digital transformations and disruptions, many technology companies continue to amaze us with ever increasing capability and the breakneck speed of development. But beneath the surface, nearly every one of those organizations is made up of teams of employees who are tasked with delivering better results year after year. Technical capability is no longer enough to achieve long-term success. Soft skills are now a key factor in distinguishing high performing organizations from those that struggle, and their effect is far reaching.
In this article, I’ll explore the role of soft skills as they relate to technology-focused positions and investigate strategies for integrating these skills into the hiring process.
Many technology companies create a major challenge for themselves in that they focus so heavily on identifying and honing the technical skills that they lose sight of these soft skills. This can lead to information disconnects, dysfunctional behavior, and broken chemistry within the team. Missed opportunity often follows.
Initiatives that move the needle for an organization don’t happen within a vacuum. They require interdisciplinary teams to work together effectively and efficiently. Soft skills like communication, collaboration, emotional intelligence, and problem solving (among many others) are the capabilities that an individual possesses that enable them to do so. They are central to high team performance and the ability to create raving fans as customers.
At one level or another, technology employees must interact with internal and external clients and stakeholders who may not have technical backgrounds. Soft skills such as empathy, patience, and the ability to explain complex concepts in non-technical terms are crucial in building rapport, managing expectations, and ensuring their satisfaction.
To read this entire article, which appeared in the July 2023 issue of PCB007 Magazine, click here.
Suggested Items
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
Dubai Launches Global Blueprint for Artificial Intelligence
05/02/2024 | BUSINESS WIREDubai has launched a blueprint for Artificial Intelligence (AI), a yearly plan that will focus on harnessing the technology’s potential to improve quality of life around the world.
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.
IDTechEx Report on Quantum Technology: Nano-scale Physics for Massive Market Impact
04/30/2024 | PRNewswireThe quantum technology market leverages nano-scale physics to create revolutionary new devices for computing, sensing, and communications. Across the industry, quantum technology offers a paradigm shift in performance compared with incumbent solutions.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.