-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Pivoting on Substrates
September 27, 2023 | I-Connect007 Editorial TeamEstimated reading time: 2 minutes
Oved Shapira is CEO of PCB Technologies, the Israeli-based printed circuit provider. PCB Technologies has recently invested in facilities and expertise to design, fabricate, and assemble substrates, a key component for advanced packaging technologies. Oved spoke with Barry Matties and Nolan Johnson about how advanced packaging will influence the industry. He said it will shift everything, including design, fabrication, assembly techniques, and capital equipment development. Some of these shifts might be subtle, and others more seismic. Whatever the changes, Oved says it’s coming.
Barry Matties: Since you joined the company, you have been instrumental in defining the direction for PCB Technologies. Could you give us an overview of the company’s current strategic direction?
Oved Shapira: When I joined the company, I first asked where we were heading and where the market was going. For our major customers, what were their projected unmet needs? I asked our CTO to talk with the CTOs of our major customers as a way to develop a multi-industrial vision with advanced technology included.
Of course, when you ask CTOs about their unmet needs, you get much feedback from different angles. When you filter out all the feedback, we found three major issues that keep repeating.
Matties: What were those issues?
Shapira: First was miniaturization. Second was heat dissipation management, which is very much connected to the miniaturization of more functionalities and the growing demand for high-power applications. The third was the registration of mixed materials.
Registration is one of the larger causes of failure on the PCB, Everything that involves multilayer and sub-lamination always has the risk of poor registration. That creates shorts or other quality issues. So, we came back to the drawing board with what we learned.
I joined after the largest private equity fund in Israel acquired the company. We had a favorable cash situation and decided to invest the capital in technologies that would serve miniaturization, heat dissipation, and registration. That’s when we built a strategy of all-in-one. You can have a PCB shop, an assembly service, and advanced packaging of multi-chip modules or SIP (system in package).
So, we upgraded the PCB shop to PCB-like substrates. Today, we can go for a pitch of 50 microns, line space of 25/25, or 20/30.
We create a unique design of organic substrates by integrating copper-moly-copper. We give them a solution for heat dissipation and heat management in combination with miniaturization. Then, we add to the substrate all our capabilities in PCBs.
To read the rest of this interview, which appeared in the September 2023 issue of PCB007 Magazine, click here.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/03/2024 | Nolan Johnson, I-Connect007This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.
HQ NextPCB of HQ Electronics Debut on the International Stage for Electronics Manufacture at IPC APEX 2024
05/01/2024 | PRNewswireHQ NextPCB of HQ Electronics, a leading Chinese-based multilayer PCB manufacturer and assembly house showcased its industrial prowess on the international stage for the first time at the IPC APEX Expo 2024.
IPC's Vision for Empowering PCB Design Engineers
04/30/2024 | Robert Erickson, IPCAs architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.
On the Line With… Talks With Cadence Expert on SI/PI for PCB Designers
05/02/2024 | I-Connect007In “PCB 3.0: A New Design Methodology—SI/PI for PCB Designers,” subject matter expert Brad Griffin, Cadence Design Systems, discusses how an intelligent system design methodology can move some signal and power integrity decision-making into the physical design space, offering real-time feedback.
USPAE to Springboard U.S. Technology Forward
04/30/2024 | Marcy LaRont, PCB007 MagazineThe U.S. Partnership for Assured Electronics (USPAE) was launched as a nonprofit subsidiary of IPC in 2020, specifically to manage the DoD relationship and access to funding, and to develop a cooperative facility to develop UHDI capabilities in the U.S., not only for the defense sector, but for the whole of the U.S. electronics industry. It is a tall order, but industry veteran Joe O'Neil believes it will happen. Having been tasked with making the UHDI Capable Cooperative Production Facility (UCCPF) a reality, he provides an update on this important project for U.S. electronics manufacturing.