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Registration: From Raw Data to Intelligent Manufacturing
November 27, 2023 | Andrew Kelley, XACTPCB LTDEstimated reading time: 1 minute
While previous industrial revolutions have introduced factories, mass production, and computer-controlled systems, the advent of Industry 4.0 and the concept of the Smart factory have ushered in a new era in PCB manufacturing. For the PCB industry it is a very ambitious and aspirational objective to evolve from disconnected processes to an integrated system with automated data capture, real-time data analysis, process visualization, autonomous control, and self-correcting processes.
Industry experts claim that those who fail to engage will rapidly fall behind, however, the paradigm shift that this revolution brings to manufacturing has left many plant managers wondering where and how to start the process of implementation. The reality is that implementation of a Smart factory is not a one-size-fits-all approach, and companies need to adapt their existing systems, process, and infrastructures to embrace this transformation gradually.
In the PCB manufacturing plant, there is a profusion of design and production data that is held in many places and in many different formats. There is an opportunity to incorporate this information with data gathered in real time from manufacturing processes to provide intelligent analysis, derived actions, and control immediately for use throughout the manufacturing process chain. Very few companies will start a Smart manufacturing implementation from nothing. The key will be to understand how to adapt existing systems, process, and infrastructures to the requirements of the Smart factory. A step-by-step implementation focused on key aspects of manufacturing will allow the benefits to be realized soon. Therefore, the smart manufacturing solutions implemented should be modular, scalable, and flexible. This approach allows businesses to establish proof of concept, leverage existing equipment, and strengthen their infrastructure without the need for building entirely new factories. To embark on this journey successfully, it is crucial to harness the power of data and transform it into actionable information and knowledge.
To read this entire article, which appeared in the November 2023 issue of PCB007 Magazine, click here.
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USPAE to Springboard U.S. Technology Forward
04/30/2024 | Marcy LaRont, PCB007 MagazineThe U.S. Partnership for Assured Electronics (USPAE) was launched as a nonprofit subsidiary of IPC in 2020, specifically to manage the DoD relationship and access to funding, and to develop a cooperative facility to develop UHDI capabilities in the U.S., not only for the defense sector, but for the whole of the U.S. electronics industry. It is a tall order, but industry veteran Joe O'Neil believes it will happen. Having been tasked with making the UHDI Capable Cooperative Production Facility (UCCPF) a reality, he provides an update on this important project for U.S. electronics manufacturing.
Real Time with… IPC APEX EXPO 2024: Insight into Summit Interconnect's Success
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