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High Density Packaging User Group Announces Gold Circuit Electronics Membership

02/06/2024 | HDP User Group
High Density Packaging User Group (HDP) is pleased to announce that Gold Circuit Electronics (GCE) has become a member. 

HDPUG: 30 Years of Collaboration

01/01/2024 | Madan Jagernauth, Marketing Directory HDP
The High Density Packaging User Group International Inc. (HDP) and IPC have partnered successfully for many years. The groups signed an MOU in 2020 to strengthen this relationship, increase technical collaboration between the groups, and provide a mutual path toward emerging and disruptive high-density interconnect (HDI) technologies. IPC became a member of HDP at that point.

High Density Packaging User Group Announces Uyemura Membership

10/18/2021 | HDP User Group
High Density Packaging (HDP) User Group is pleased to announce that Uyemura International (Uyemura) has become a member.

RTW IPC APEX: HDPUG's Jack Fisher Discusses Updates on Optoelectronics Project

04/04/2017 | Real Time with...IPC
The HDPUG Optoelectronics project set out to demonstrate that optical waveguides incorporated within a backplane could benefit the system's interconnect topology. HDPUG facilitator Jack Fisher explains that a demonstrator has now been built and is currently under test at a number of leading OEMs.

Real Time with...IPC 2017 Videos Now Available for Viewing

02/15/2017 | Real Time with...IPC
Over 70 video interviews from the IPC APEX EXPO 2017 show in San Diego, CA are now available for viewing. See the opening ceremony, hear from suppliers and others on their new products, learn more about the HDP Users Group. Don't miss the videos by IPC President John Mitchell and his staff.
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