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NPL Webinar on Effect of Bias on CAF Failures of Electronic Circuits
June 11, 2019 | NPLEstimated reading time: Less than a minute
High reliability in service is the key issue in today’s high-density electronic circuits. And the voltage applied to the electronic circuit plays a very important role in electrochemical reliability. Insulation resistance (IR) measurement has been widely used to predict and evaluate the reliability of electronic circuit. But the test voltages for existing IR measurement are only up to 300V. With the trend toward more electric vehicles, measurements need to be conducted at significantly increased voltages to understand potential new failure mechanism when using voltages up to 1,000V.
In line with this, the National Physical Laboratory will hold a webinar on July 16, 2019 to help the industry understand the effect of bias (up to 1,000V) on conductive anodic filament (CAF) failures of electronic circuits. For this webinar, NPL has commissioned a 1,000V IR test facility for demonstration.
For more information or to register, click here.
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01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
Standard Of Excellence: The Products of the Future
09/19/2023 | Anaya Vardya -- Column: Standard of ExcellenceIn my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering
09/18/2023 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute
09/18/2023 | IntelIntel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.