-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Ford, Pedersen, and Tranitz Receive Dieter Bergman IPC Fellowship Award
March 11, 2021 | IPCEstimated reading time: 1 minute
Three IPC volunteers who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts, were presented with Dieter Bergman IPC Fellowship awards at IPC APEX EXPO 2021. Michael Ford, Jan Pedersen, and Peter Tranitz were chosen as award recipients because they embody the work ethic and spirit of the late Dieter Bergman, a pioneer and industry icon. They will bestow Dieter Bergman Memorial Scholarship awards on the university or college of their choice.
Michael Ford, Aegis Software, is an established thought leader for Industry 4.0 and digital smart factories. Serving on 18 technical committees including the Committee Chairman Council, the Connected Factory Initiative (CFX) Subcommittee, Supply Chain Traceability and Trust Subcommittee, and the Technical Activities Executive Committee (TAEC), Ford chose the engineering department of Villanova University, alma mater to the founders of Aegis, as the scholarship recipient, with a specific request that it be used to promote an opportunity for a woman in the industry.
Jan Pedersen, Elmatica, active on 30 IPC committees, is the chair of the IPC-6012 Medical Addendum Task Group and the IPC-6012 Automotive Addendum Task Group. Pedersen led the development of the first IPC document dedicated to automotive electronics – IPC-6012DA, and the first dedicated to medical device electronics – IPC-6012EM.
Pedersen chose a specific project as the recipient of the Dieter Bergman memorial scholarship. Two universities – one in Norway and one in Romania, collaborate to create an arm neuroprosthesis equipped with artificial skin and sensorial feedback for patients with partially amputated limbs. Elmatica has agreed to double the scholarship so that two students will receive the benefit of the Dieter Bergman award.
Peter Tranitz, Continental Automotive, is active on several IPC committees, and co-initiated the Cold Joining Press-fit Task Group and Cold Joining Press-fit Handbook Task Group, serving as co-chair. An expert in press fit technology and tin whiskers, Tranitz was instrumental in developing IPC-9797, High Reliability Press-fit standard. Tranitz offered his scholarship to the physics department at the University of Regensburg, Germany.
“The recipients of this year’s Dieter Bergman Fellowship award have brought innovation and international influence on IPC standards development. We are indeed fortunate that they have chosen to volunteer their considerable talents and expertise with IPC and the electronics community,” said John Mitchell, IPC president and CEO.
Related Article:
Jan Pedersen: Dieter Bergman IPC Fellowship Award Recipient
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/26/2024 | Andy Shaughnessy, Design007 MagazineIn this week’s roundup, we have a variety of articles covering everything from design through assembly, and even box build. I’ve always wondered whether box build was all it was cracked up to be. Do customers really pick one EMS provider over another because one company offers box build? And if you’ve ever wanted to volunteer, IPC’s Thought Leaders Program is looking for a few good technologists to help them on their mission. Check out Stanton Rak’s article, which was published in the spring issue of IPC Community.
Stan Rak: Elevating the Ideas and Insights of IPC's Thought Leaders Program
04/25/2024 | Stanton Rak, SF Rak CompanyAs a member of the IPC Thought Leaders Program (TLP), I am responsible for identifying knowledge-sharing opportunities that can generate ideas and insights that strengthen the IPC community as well as create a sustainable and lasting future for its members. I am delighted to highlight some of my recent contributions as a member of the TLP.
Alternative Manufacturing Inc. Awarded QML Requalification to IPC J-STD-001 and IPC-A-610
04/24/2024 | IPCIPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) requalification to Alternative Manufacturing Inc (AMI).
IPC Design Competition Champion Crowned at IPC APEX EXPO 2024
04/24/2024 | IPCAt IPC APEX EXPO 2024 in Anaheim, California, five competitors squared off to determine who was the best of the best at PCB design.
Big Win for Defense Production Act Budget Allocation in FY24 Budget
04/23/2024 | I-Connect007 Editorial TeamOne year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.