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Show & Tell Magazine Now Available on Demand
05/04/2021 | I-Connect007 Editorial Team
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/30/2021 | Nolan Johnson, I-Connect007
EIPC Technical Snapshot: Supply Chain and Material Price Pressures
04/26/2021 | Pete Starkey, I-Connect007
Isola Releases IS550H Material
04/26/2021 | Nolan Johnson, I-Connect007
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/23/2021 | Andy Shaughnessy, I-Connect007
PCB :: Fabrication Process
Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 2
A limitation of many 3D optical inspection systems is the cycle time typically associated with processing millions of pixels to reconstruct a full 3D image using data captured from multiple channels. There should not be a compromise between 3D inspection and throughput. A successful inspection deployment should provide oversight for the process, not compromise, interrupt or slow that process.
EIPC Technical Snapshot: 5G and Loss Minimisation
Bringing a specialised technical area into sharp focus, this month’s topic was “5G and the understanding of loss minimisation at the PCB level,” with papers on dielectric material, copper foil, and modelling solutions. The webinar was moderated by EIPC board member Paul Waldner managing director of Multiline International Europa, who admitted that he had managed to get a haircut especially for the occasion!
With Pluritec, it’s All About Automation
Lino Sousa, vice president of sales with Pluritec, reviews the company’s specialist equipment ranges and discusses the benefits of automation of drilling, solder mask application and wet processing in small-batch, quick-turnaround PCB production.
PCB Requirements for E-Mobility
Nolan Johnson, Barry Matties, and Happy Holden speak with Christian Klein, section manager for PCBs in the automotive electronics division, about Bosch’s recent presentation on PCB requirements of the future in regard to automotive and electro mobility trends and challenges.
What's Hot in the PCB Equipment Market?
Mike Brask, president and CEO of IPS, shares the technology customers in the PCB sector are most interested in and discusses increasing market demands.
The Real Benefits of Inkjet Solder Mask
Shaun Tibbals, sales and marketing director at Electra Polymers, describes the technical, environmental and economic benefits of fully additive solder mask application by inkjet printing, now becoming accepted as the industry-standard technology for the future.
Taiyo Does It Right
In this video interview, Editor Dan Feinberg and Taiyo America's Zach Maekawa discuss the ways that Taiyo adds value to the supply chain while driving innovation in solder mask technology. As Zach explains, Taiyo works with customers and OEMs, measuring all of the “nitty gritty stuff.”
Heraeus Introduces New High-Reliability Solder Paste
Manu Vaidya discusses the SMT650 high-reliability solder paste Heraeus Electronics is showcasing at APEX 2021 in order to satisfy rising automotive demands.
Distributor Just One of Many Roles for all4-PCB
Torsten Reckert, president of all4-PCB, discusses his company's role as a distributor, and the technologies available under their representation. Reckert points to via fill as a key technology, as well as lamination, flash-cutting automation, plasma processing, cross-section equipment, wet processing, among others. The company also manufactures solder resist capital equipment and special machine parts, and is a leader in process optimization.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
A perennial and yet irregular category on the popular game show Jeopardy is “potpourri.” My dad, as I was growing up, pronounced the word as “pot-poury.” It wasn’t until I was a sophomore in college that my girlfriend’s mom—who had a penchant for a soupcon of French euphemism in her tête-à-têtes—pronounced the word properly: “po-pu-ree.” Such are the risks of growing up just a bit rural.
Real Time With… Premium Sponsors Share ‘Top 5 Things You Need to Know’
As part of I-Connect007’s coverage of the IPC APEX EXPO 2021, four premium sponsors share their knowledge and expertise in the following categories.
ICT Webinar: Novel Materials and Methods for Printed Circuit Fabrication
For the first time since its foundation in 1974, the Institute of Circuit Technology had no alternative than to conduct its Annual General Meeting online. The event, which took place on February 25, 2021, was remarkably well-attended, and was followed, as is traditional, by a technical seminar. The seminar became a webinar focused on novel materials and methods for printed circuit fabrication and moderated by ICT Chair Emma Hudson.
Focus on Smart Processes, Not Just Smart Factories
Nolan Johnson talks to Audra Thurston, Todd Brassard, and Meredith LaBeau about how Calumet is focusing on smart processes, and not as much on smart factories. While modern manufacturing equipment and next-gen technologies can be impressive, so much innovation still hinges on human beings. Calumet believes by investing in their workforce and instilling a culture of innovation throughout their company and supply chain, they’ll see faster advancement.
EIPC Technical Snapshot: Cleanliness
John Ling’s invitation to the fifth in EIPC’s series of Technical Snapshots was as droll as we have come to expect: “In these confined days of lockdown, and exhortations to stay at home and only go out for exercise, this only exercises the natural inclination to hop on a ‘plane to some sunshine.’ Although not the same as Factor 20, one of our webinars gives a high degree of protection from harmful ignorance, and you do not have to go out in the cold.”
Functional Inkjet Printing in PCB Manufacture
Pete Starkey speaks with Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands B.V., about advances in inkjet printing, even outside the lab.
The Benefits of Statistical Process Control
The concepts of statistical process control were initially developed by Dr. Walter Shewhart of Bell Laboratories in the 1920s, and were expanded upon by Dr. W. Edwards Deming, who introduced SPC to Japanese industry after WWII. After early successful adoption by Japanese firms, SPC has now been incorporated by organizations around the world as a primary tool to improve product quality by reducing process variation.
Benchmarking With Your Suppliers: What to Know About Solder Mask
Everyone wants a smooth-running solder mask process with high productivity and minimal rejects, but to achieve this you really need a firm understanding of what your current process is capable of, what its limitations are, and what you want to improve. Process capability benchmarking is a great way to identify and implement improvements within your process.
Kemmer Praezision Partners with Insulectro
In this interview, Nolan Johnson and Gregor Dutkiewicz discuss Kemmer Praezision, their new working partnership with Insulectro, and some of the recent market challenges in mechanical drill bit technology.
The Future of Imaging and Inkjet Printing
We recently spoke to Ed Carignan of Technica, who outlines the current landscape for both direct imaging and inkjet printing and describes how the technologies have evolved over the years. He also details what’s next on the horizon.
EIPC Technical Snapshot: Business Outlook
A headline in a Sunday newspaper had caught John Ling’s eye as he composed the invitation to this fourth EIPC seminar: “Now, more than ever, we need to talk.” Thus, it is that EIPC decided to run another technical webinar, which was just like one of their in-person conferences, except no one had to travel—or got to enjoy a beer or excellent food with convivial company.
Tech 2 Tech: KYZEN’s Short Technical Sessions a Big Hit
Nolan Johnson gets an update from Tom Forsythe on KYZEN’s Tech 2 Tech sessions. These brief 15-minute sessions were set up during the pandemic by KYZEN for customers, prospects, and new engineers around cleaning, and have since found traction with their manufacturers, reps and distributors.
MivaTek’s New Technology and Market Drivers
I recently spoke with Brendan Hogan about the upcoming new product releases from MivaTek. The conversation flows naturally from the new product’s market drivers to the X=Xc – 1 idea that is at the core of the market drivers.
Chapter 1 Excerpt: The Printed Circuit Assembler’s Guide to Process Validation
The original principle underlying the IPC’s ionic cleanliness requirement was that the mobility of surface ions, detectable from SIR measurements, would correlate to a maximum value of detectable ionic elements permissible on the circuit surface. The industry required a test that was both fast and accurate for process control. Thus, a simplified ion chromatograph that was able to detect ionic elements without differentiation was created.
Millennials and Seasoned Veterans: Your Future Lies in Both
There is no doubt that we are having a crisis when it comes to the workforce in our industry today. In the PCB and PCBA industries, as well as most manufacturing industries, there is a definite shortage of good people we can hire. Dan Beaulieu describes how the future of the electronics manufacturing industry lies in both millennials and seasoned veterans alike.
EIPC Technical Snapshot: PCB Surface Finishes
For the third in a series of Technical Snapshot webinars, EIPC chose to focus on PCB surface finishes, comparing specific properties, examining corrosion behaviour and discussing selection criteria for low-loss, high frequency applications.
Ucamco Webinar Explores Benefits of Front-End Automation Tool
I have known the Ucamco people for over 30 years and recognise their company as an industry-leading provider of PCB CAM and pre-CAM software, as well as laser photoplotters and direct imaging systems. The team has always endeavoured to understand customer needs—often to anticipate them—and to respond with innovative solutions.
Happy’s DIY Solution to Chemical Control
I confess. I am a control nerd and highly analytical. My second degree is in EE control theory, and I see the world in terms of feedback loops and black boxes. Early in my career, I was volunteered for the technical programs for the California Circuits Association (CCA), which was created by my mentor Clyde Coombs. In discussions with fellow process engineers, it was clear that the chemical process controls that HP could afford and allow me to put in place were not able to be duplicated by much smaller PWB shops.
Pacothane on the Future of Laminate Technologies
Nolan Johnson recently spoke with the Pacothane Technologies team about the current drivers of circuit board technology and how that has influenced and increased their product development of lamination and lamination assist products.
Lorain County Community College’s Successful MEMS Program
The I-Connect007 editorial team had the pleasure of an extended and detailed conversation with Johnny Vanderford and Courtney Tenhover from Lorain County Community College (LCCC). Vanderford and Tenhover are at the heart of the microelectromechanical systems (MEMS) program at LCCC that is emerging as a model for a successful technical higher-education program. This conversation was lively, and the enthusiasm at LCCC is infectious, as it should be; their results are impressive.
Stephen Chavez and Happy Holden on Designing Reliable Vias
Andy Shaughnessy and Happy Holden speak with Stephen Chavez, a staff engineer with an aerospace company and chairman of the Printed Circuit Engineering Association (PCEA), about designing vias for greater reliability. They also address several areas where they can look to improve reliability, a variety of steps that designers should take to help ensure more robust vias, and some testing and educational resources that PCB designers and design engineers should be aware of.
GreenSource Fabrication Creates Plating Flexibility
The I-Connect007 editorial team spoke with GreenSource Fabrication’s Alex Stepinski, VP and officer, and Rick Nichols, product engineer, about plating capabilities, new equipment developments, and how best to create more plating flexibility in a shop.
EIPC Technical Snapshot: Market Analysis and Advanced Manufacturing Tech
Pete Starkey details the November EIPC webinar program that combined knowledgeable market analysis and advanced manufacturing technology, including insights from Prismark's Dr. Shiuh-Kao Chiang, Averatek's Mike Vinson, and Atotech's Roland Herold.
Catching up With QCMS General Manager Rick McAnally
Founded in 2007, QCMS is one of the more interesting EMS companies on the East Coast. They are actually a sister company to Niche Electronics located in Pennsylvania. Dan Beaulieu interviews QCMS General Manager Rick McAnally.
Institute of Circuit Technology Technical Webinar
With its regular program of physical seminars and symposia on hold, the Institute of Circuit Technology went virtual and presented a webinar of three technical papers, organized by Technical Director Bill Wilkie and introduced by IPC Chair Emma Hudson. Pete Starkey brings you all the details.
This Month in SMT007 Magazine: Test and Measurement in a Smart Factory
Nolan Johnson spoke with MIRTEC President Brian D’Amico about how the role of test and measurement equipment is changing in the smart factory and how shops can adjust to make use of the new technology. D’Amico shares this insight: “While approximately 90% of U.S. electronics manufacturers recognize the potential of Industry 4.0 to improve productivity, many are slow to adopt smart factory solutions within the manufacturing process.”
Real Time with… AltiumLive 2020: Vince Mazur Previews New Design Rule Features
Altium Technical Marketing Manager Vince Mazur discusses his presentation at the recent AltiumLive, which focused on updates to Altium Designer's approach to creating design rules and constraints. Vince explains that these features will be more intuitive for the user, and the update, which is currently in beta, will be released in the future. The company is shifting from “rule-centric” design rules features to capabilities that are more “design-centric,” with applicable rules for each object available at one click.
Reducing Flux Splatter in Sensors and Camera Modules
With the increased use of electronics in new technology areas, flux formulations are being developed to address the new and existing requirements. For sensors and camera modules used for Advanced Driver Assistance System (ADAS) and internet of things (IoT) applications, there is a demand for no-clean flux formulations in lead-free solder paste, which can reduce flux splattering during reflow.
Real Time with… Altium Live Europe 2020: Rick Hartley’s Secrets of PCB Optimization
As Lawrence Romine said in his introduction, “There’s that moment when you sit in the crowd and hear Mr. Rick Hartley speak that you know you’ve arrived in PCB design.” With 50 years in the industry focused on circuit and PCB design—and as a specialist in EMI, noise, and signal integrity issues—Rick Hartley was invited to talk about PCB optimization. Pete Starkey provides an overview of the presentation.
Gardien on the Right Track With New ERP System
Andy Shaughnessy speaks with Roland Valentini, Gardien Group COO, about the company’s new OnTrack2 ERP and process management software. He explains how OnTrack2 is purpose-built for customers around the world and why it’s much more than a replacement for OnTrack1, which was being stretched beyond its original intent.
IPC Standards Development: Business Challenges and an Inside View
With increasing frequency, standardising the standards, such as ISO 9201, imposes certain rules that must be met to ensure “fair play” amongst the supply chain. There will be those familiar with hearing about “false positives/negatives” and “never trust the salesman,” so mitigating these is no easy task. However, there is the chance for each 5-30 Task Group to review industry requirements and set out the work program for the ensuing period. With that in mind, much of what follows is based on comments we learn about from our industry around the world, many of whom are not yet IPC members. Yes, this is a membership recruitment drive, unashamedly, as well as a search for volunteers willing to help create the standards of tomorrow.
How to Benefit From Robotic Soldering Processes
Webinars are in vogue! But in Pete Starkey's experience, the master of the technical webinar with many years’ experience of delivering first-rate events is Bob Willis—electronics assembly specialist, soldering expert, and provider of training and consultancy in electronics manufacture. Here, Pete recaps Bob’s presentation on the upcoming robotic soldering experience.
90% Solder Dross Recovery: Eliminate Waste, Save Money
The impact of 90% solder dross recovery can have a substantial impact on reducing waste and increasing cost savings. Nolan Johnson recently spoke with Jay Hardin, MS2® product manager at P. Kay Metal, about the process and benefits of efficient solder dross recovery, as well as product roadmaps, the soldering machine market, and raw materials supply chain for solder alloy manufacturing. As Jay says, “For many companies, the savings are in the thousands or millions” of dollars.
EIPC Technical Snapshot: Automotive Technology
Although current circumstances have forced the postponement of its live conferences, seminars, and workshops, EIPC continues to provide a platform for the exchange and dissemination of the latest knowledge and technical information to the European interconnection and packaging industry. Pete Starkey details how its current series of technical snapshots, delivered in a webinar format, address technology challenges facing the automotive, telecom, and high-speed sectors of the industry.
Just Ask Paul: Automotive and Lead-Free Solders
We asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, John Mitchell, and Greg Smith in our “Just Ask” series. Now, MacDermid Alpha Electronics Solutions’ Paul Salerno gets a chance to answer a question. Paul Salerno is a global portfolio manager for SMT applications focused on the automotive and consumer market segments. He holds a bachelor’s degree in materials engineering as well as an MBA in finance and marketing from Rutgers University.
Real Time with… AltiumLive 2020: Eli Hughes’ Full-Stack Hardware Engineer Keynote
Nolan Johnson details TZero Co-founder Eli Hughes' keynote presentation titled “Crossing the Chasm: The Road to Becoming a Full-Stack Hardware Engineer,” demonstrating how it takes cross-disciplinary thinking to truly innovate.
Real Time with… AltiumLive 2020: Würth Virtual Factory Tour
Since AltiumLive this year is a virtual event, coverage is limited to watching some of the presentations virtually. Dan Feinberg describes how he was pleasantly surprised with the quality and excellence of the Würth virtual factory tour.
Real Time with… SMTAI 2020: Reflections on the Technical Conference
This year’s SMTA International Conference and Exposition went virtual! Pete Starkey explains how the SMTA team did a fine job in difficult circumstances to present an interactive show and technical conference. Here, he highlights four of the papers that particularly caught his interest.
Real Time with… SMTAI 2020: Technical Conference Review
SMTAI 2020, which was converted to a virtual event, took place from September 28–30. I attend every year, but since there was no keynote in the virtual format, I went straight to the technical conference. This event covered a broad range of topics related to everything in assembly. Over 90 technical presentations are available, but this report covers just some of the sessions I attended.
Just Ask John Mitchell: The Exclusive Compilation
We asked for you to send in your questions for IPC President and CEO John Mitchell, and you took us up on it! We know you all enjoyed reading these questions and answers, so we’ve compiled all of them into one article for easy reference. We hope you enjoy having another bite at the apple. And if you’d like to hear more from John Mitchell, view his column series “One World, One Industry.”
Just Ask John Mitchell: Blurring the Lines of Technology
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! A regular PCB007 columnist, John focuses on many of the challenges affecting the global electronics industry supply chain. Over the years, he has served as an engineer, manager, and executive at a variety of companies and organizations. We hope you enjoy “Just Ask John.”
Real Time with...SMTAI 2020: MacDermid Alpha’s Flash Etching Electroplating Paper
I-Connect007’s Nolan Johnson catches up with Sean Fleuriel, a chemist for MacDermid Alpha Electronics Solutions, and Richard Bellemare, director of electrolytic metalization, to discuss the SMTAI technical paper presented by Fleuriel, titled, “Pit Resistant Acid Copper Electroplating Process for Flash Etching.” Fleuriel and Bellemare highlight the challenges, processes, and conclusions from the paper, as well as which PCB fabricators are most likely to benefit from this new process.
Real Time with…SMTAI 2020: KYZEN on How Maximized Stencil Life Improves Yields
KYZEN Executive Vice President Tom Forsythe shares company updates on stencil cleaning with Nolan Johnson. KYZEN recently announced its newest stencil cleaning product—KYZEN E5631. Forsythe details how the product is best used, as well as the benefits it brings to maximizing stencil life and improving manufacturing yields.
Just Ask Eric: Selecting the Right Lead-Free Solder for Your Application
First, we asked you to send in your questions for Happy Holden and Joe Fjelstad in our “Just Ask” series. Now, it’s Eric Camden’s turn! A regular SMT007 columnist, Eric is a lead investigator at Foresite Inc., an analytical testing and consulting laboratory. As a reliability expert, Eric has worked with many large OEMs and contract manufacturing companies to optimize their manufacturing processes and assist with the identification of electronic hardware failures utilizing various analytical techniques. He also specializes in optimizing PCBA processes and identifying hardware failures through analysis. We hope you enjoy “Just Ask Eric.”
Catching up With Nate Doemling, New CEO of IMS
Dan Beaulieu recently interviewed Nate Doemling with Intelligent Manufacturing Solutions (IMS) in New England about his new role at the company. After serving on the IMS board of directors for several months, Doemling joined the company as CEO in January 2020.
New Solder Joint Technology From Schmartboard
Schmartboard has a surprisingly simple patented process to improve solder joint reliability; in this interview, they discuss the process in detail, along with their search for a go-to-market partner.
Aurora Circuits on Ultra-Heavy Copper PCBs
It’s always fun to talk with a company that can do something different—in this case, ultra-heavy copper PCBs, meaning over 20-ounce copper. Wanting to know more, Dan Beaulieu talked to Aurora Circuits Director of Business Development Thad Bartosz.
Nano Dimension Appoints LM Instruments to Market PCB/Hi-PEDs 3D-Printers
Nano Dimension Ltd., a leading Additively Manufactured Electronics (AME)/PE (Printed Electronics) provider, has signed an agreement with LM Instruments, which will represent Nano Dimension in the Mid-Atlantic States by marketing its 3D-Fabrication Machines for High-Performance Electronic Devices (Hi-PEDs).
Dr. Ron Lasky: A Solder Alloy and Solder Paste Overview
The I-Connect007 editorial team spoke with Dr. Ron Lasky about why the world has not embraced some of the exciting alloys that companies like Indium Corporation have developed. He also provides an overview of solder alloys, including the difficulty of qualifying SAC305.
Dana Korf: What Fabricators Expect From Designers
Andy Shaughnessy and Barry Matties spoke with Dana Korf, former chief PCB technologist for Huawei and currently principal consultant of Korf Consultancy, about the breakdown in communication between manufacturers and designers. Dana discusses exactly what a fabricator expects from a PCB designer, why these expectations are often not met, and the need for designers to make mistakes so that they can learn from them.
MTV Offers Solder Paste Testing Solution
The miniaturization test vehicle (MTV) is a common benchmark test board that can gauge about 25 different paste properties and analyze how different solder pastes will perform in an assembly line. Chrys Shea details the work she’s done to develop and release the MTV.
TQM: The Tyranny of the Urgent
The I-Connect007 editorial team recently spoke with Dr. Ron Lasky about what’s stopping companies from improving their processes, especially regarding productivity.
Dan Beaulieu, Part 1: Lead Generation
Dan Beaulieu, president of D.B. Management and an I-Connect007 columnist, spoke with Nolan Johnson on the importance of continuing to generate leads and new customers. Beaulieu addressed concerns about market uncertainty, shared some real-world examples of mistakes, and made a strong case that sales and marketing is a process that must be constantly ongoing to keep a full funnel of customers and business.
Plasma Applications in the PCB Industry
Plasma, which consists of ionized gas atoms, is the fourth state of matter. On Earth, plasma does not occur naturally, but it is sometimes visible at high altitudes as auroras. But off-planet, elsewhere in the universe, almost all visible matter is plasma. Plasma is a mixture of positively charged atomic hulls, free electrons, free radicals, and neutral particles; the total electrical charge is neutral, conductive, and highly reactive. Due to permanent recombination, plasma lights can come in different colors.
Joe O’Neil: Green Circuits Running Strong Under Current Social Restrictions
On May 28, Joe O’Neil, CEO of Green Circuits, updated Nolan Johnson on how the company continues to operate during the COVID-19 restrictions. O’Neil reflects on the rapid chain of events this past March when lockdowns were instituted in the San Francisco Bay area. After a brief but rapid shutdown, Green Circuits was back up and in production.
The iNEMI 2019 Board Assembly Roadmap
iNEMI continues to publish chapters of its 2019 Roadmap and recently presented an overview of its Board Assembly Roadmap Chapter in a webinar prefaced by Grace O’Malley, vice president of global operations. The new chapter is just the latest addition to this global effort from 23 working groups contributing expert input from all aspects of the electronics industry.
Autodesk’s Fusion 360 Merges ECAD, MCAD
Andy Shaughnessy spoke with Autodesk’s Matt Berggren about the company’s Fusion 360 EDA tool and the new capabilities added to the software. Matt explains how Fusion 360 blends ECAD and MCAD functionality in one environment and at an affordable price, and why he believes it will help round out Autodesk's electronic portfolio with end-to-end capabilities.
Happy Holden Book Excerpt: CIM & Automation Strategy
The following is an excerpt from Chapter 1 of Happy Holden’s I-Connect007 eBook Automation and Advanced Procedures in PCB Fabrication. In this book, Happy explains fabrication automation with illustrative examples and anecdotes from his decades as a mechanization leader.
This Month in SMT007 Magazine: How Engineers Can Use SPI Tools for Verification
Koh Young’s Ray Welch and Brent Fischthal detail how engineers can work with SPI tools to verify how small they can go in component size with their solder paste application, and how the company’s SPI equipment is helping not only to verify but also to help drive the development collaboration between solder paste and stencil printer manufacturers, and inspection tools and software.
iNEMI’s PCB Roadmap Explained
In an informative and enlightening webinar, iNEMI Project Manager Steve Payne was joined by Isola Group CTO Ed Kelley to explain, review, and discuss the details of the recently published “iNEMI 2019 Roadmap for Organic PCBs.” Pete Starkey provides an overview.
IPC Europe Shares Technical Education and Standards Awareness
Against a background of COVID-19 uncertainty and unprecedented challenges, but recognizing the vital importance of continuing to educate engineers and share the knowledge and skills required to manufacture boards and assemblies of the highest yields and reliability, the IPC Europe team hosted a technical webinar for the European electronics industry, featuring the expertise of two of I-Connect007’s regular columnists: Mike Carano and Jan Pedersen. Pete Starkey provides an overview.
Koh Young Update With Quintin Armstrong
In this video interview from the show, Quintin Armstrong, Americas service and applications senior manager for Koh Young, updates Guest Editor Dick Crowe on Koh Young America's Technical Services Team, where the focus is on AOI of components and materials on the stuffed board, as well as demonstrations and training at their new facility in Duluth, Georgia.
Via Reliability and Robustness in Today’s Environment
When Bob Neves dropped by the I-Connect007 booth at IPC APEX EXPO 2020 this year, Happy Holden took the opportunity to record the conversation. Bob had some startling and exciting updates on the testing of microvias and through-hole technology.
SMTA Europe’s Electronics in Harsh Environments Conference and Exhibition: A Taste of Things to Come
SMTA Europe’s Electronics in Harsh Environments Conference has become a must-attend annual event; unfortunately, it also became another casualty of the COVID-19 lockdown. Scheduled to take place in Amsterdam, the Netherlands, from April 21–23, 2020, it has now been postponed until December 1–3. Pete Starkey reports on a preview seminar presented by SMTA Europe.
Stencil Cleaning Update With Tom Forsythe
In this video interview from the show, Pete Starkey and Tom Forsythe, executive VP of KYZEN, which celebrated its 30th anniversary, discuss the practicalities of stencil cleaning and describe the characteristics and capabilities of KYZEN's newest versatile stencil cleaning product.
PCB Surface Preparation Before Solder Mask on Non-copper Finishes
A circuit board is made of copper. Usually, final finishes are applied after the solder mask process. In some cases, for special applications, the final finish may be applied before solder mask. In this case, we have solder mask on ENIG or galvanic nickel-gold. It is also possible to have tin or tin-lead under solder mask; this was an old technology that no longer plays a role today.
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