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This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
Economic Headwinds
In this issue, the biggest names in PCB manufacturing share their economic outlook for the upcoming year and beyond. As you will see, they were all bullish on our industry, but there was some apprehension as well. No one wants to get burned by another the supply chain disruption.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
October 14, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
I’ve been in Washington, D.C., most of this week, attending and reporting on the IPC Advanced Packaging Symposium. You’ll see more content from me in the weeks and months to come as I sort through and highlight the varied aspects of this ground-breaking event. If you’re in this industry, advanced packaging will affect you, make no mistake about it.
The upshot is that, as an industry, we’re at an inflection point:
- Semiconductor companies are going to move to advanced packaging whether the PCB manufacturing sector is ready or not
- The emergence of UHDI to support advanced packaging will move HDI to the mainstream
- Advanced packaging capabilities will require significant investment, but is also strategically critical
- IPC has chosen to expand their mission to include advanced packaging
- The distinction between semiconductor and PCB products and processes is graying
Although the symposium was my entire world this past week, it wasn’t the only thing happening. I wasn’t surprised to see you reading about the latest news in military/aerospace, PCB panels, the CHIPS Act implementation, and microvia design.
Microvias Can Be Stacked in Certain Package Densities
Published October 13
We recently spoke with Summit Interconnect’s Gerry Partida about a pretty important discovery that his company made: Microvias can be reliably stacked in certain package densities. Microvia failure has been a big issue for fabricators lately, especially military contractors, but as Gerry explains, microvias don’t have to be staggered every time—as long as you do your homework and simulate.
Boeing-Built SES Satellites Send, Receive First Signals
Published October 7
It was a big week for Boeing, which successfully launched the SES-20 and SES-21 satellites. In the company’s announcement, it said the satellites will allow them to support customers in delivering high-quality sports and entertainment to tens of millions of U.S. households “while delivering on our promise to repurpose spectrum to enable U.S. leadership in 5G.” More and better sports coverage? Now that’s something worth mentioning.
CHIPS Act Implementation Requires Strong Focus on 'Advanced Packaging,' Industry Leaders Say
Published October 11
This news item from IPC helped promote the symposium, but the information it contains is still relevant even though the event has concluded. For example, 94% of electronics industry leaders report that improving the performance of semiconductors is increasingly reliant on advanced packaging. And 84% of electronics industry leaders believe government initiatives to bolster the semiconductor supply chain require significant investment in advanced packaging capabilities. It’s encouraging to know that these companies see where PCB manufacturing is headed and are on board with it. I’m really looking forward to writing and reporting more on this fascinating direction for our industry.
Panel Manufacturers Enact Strict Production Controls to Balance Supply/Demand, 4Q22 Forecast to Drop
Published October 7
Not all sectors of electronic component manufacturing are in go-go mode at the moment. LCD manufacturers are advising that utilization rates could slip to 60%, which TrendForce says is the lowest level in 10 years. Most panel makers have flipped from operating at a profit to operating at a loss in the second half of 2022. Production reduction plans are currently being implemented, according to the report. For us in the PCB design and manufacturing sectors, this is something to keep our eye on.
FKN Systek: Singulating Pre-Scored PCB Panels up to 48” Long
Published October 7
FKN launched the U.S.-made K4000 motorized depanelizer and readers took notice. Given that the start of Q4 in the calendar year is when new equipment is forecast, could it be that panel cutters are on companies’ wishlists this year?
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Join The Murray Percival Co. at IPC APEX EXPO 2024
03/15/2024 | Murray Percival CompanyThe Murray Percival Company, the award-winning leading supplier to the Midwest’s electronics industry, is excited to announce their participation in the upcoming IPC APEX EXPO, scheduled for April 9-11 at the Anaheim Convention Center in Anaheim, CA.
ROCKA Solutions Expands into Brazil
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Much Ado About Factory of the Future
03/13/2024 | Chris Jorgensen, IPCFor attendees looking for guidance on modernizing their manufacturing, IPC APEX EXPO 2024 will provide plenty of opportunities to learn about the latest innovations and how to begin applying them in your operations today. When walking the show floor, look for the IPC-CFX flags at vendor booths. These are equipment vendors who know the importance of IPC-CFX for their customers and the industry, and have demonstrated proficiency in IPC-CFX implementations.
DARPA Explores Additive Manufacturing’s Revolutionary Potential for Futuristic Microsystems
03/12/2024 | DARPADARPA played a seminal role in establishing materials science as a discipline. One of the latest disruptive efforts in new materials and applications, the Additive Manufacturing of Microelectronic systEms (AMME) program, seeks to launch microsystems manufacturing far beyond today’s state of the art.