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EIPC Technical Snapshot: Automotive Technology
10/19/2020 | Pete Starkey, I-Connect007
I-Connect007 Editor's Choice: Five Must-Reads for the Week
10/16/2020 | Nolan Johnson, I-Connect007
This Month in PCB007 Magazine: The Acceleration or Deceleration of Change
10/16/2020 | Dan Feinberg, I-Connect007
Real Time with… AltiumLive 2020: Würth Virtual Factory Tour
10/13/2020 | Dan Feinberg, Technology Editor, I-Connect007
An Update on Walt Custer’s EIPC Business Outlook Webinar
10/12/2020 | Pete Starkey, I-Connect007
PCB :: Associations
EIPC 50th Anniversary Conference Day 2: The Past, the Present and the Future, Pt. 1
The sun was shining in Dusseldorf as delegates returned to the conference room for the second day of the EIPC 50th Anniversary Conference. There were very few empty chairs—even those who had enjoyed a late networking session in the hotel bar had taken their seats as Paul Waldner opened the proceedings with Session 5, on a theme of future PCB design, material and processes for the PCB supply chain.
The PCB Norsemen: The Velocity of Technology— What Does It Really Mean?
Driving a car is probably one of the areas where the user comes in direct touch with the technology development. And we understand the speed when we see how fast we get new versions of smartphones and other gadgets. But in what direction are we going?
PCB Material Toolbox for Today’s 3G and 4G Networks and Future High-Speed Needs in 5G
The material toolbox idea first came up when I saw the IPC appendix list for standard 1-ply stack-ups. The idea is to make a very simple bill of materials, specifications and notes, and possibly use the same prepreg/resin in the laminate and in the core.
5G—Generation after Generation
If you’re like me, you’ve probably heard of 5G, but you may not understand what all the fuss is about. First, 5G simply means fifth-generation mobile networks. The best way to understand what 5G is about is to understand all the other Gs, like 3G and 4G (we rarely hear about the early Gs!).
The Institute of Circuit Technology Annual Symposium 2018
ICT technical director Bill Wilkie is well-known for choosing notable venues for Institute of Circuit Technology events, and his choice for this year’s Annual Symposium was the National Motor Museum, located in the village of Beaulieu in the heart of the New Forest, a national park in the county of Hampshire in Southern England. The region is known for its heathland, forest trails and native ponies.
Golden Anniversary for EIPC at the 2018 Summer Conference
June marks the start of summer, and with that, the EIPC’s annual summer conference. Highlighted by its thought-provoking presentations, social outings and factory tours, the conference continues to be valuable and productive for attendees. This year should prove no different, with EIPC set to celebrate its 50th anniversary. I spoke with EIPC Executive Director Kirsten Smit-Westenberg about what can be expected from the upcoming conference in Düsseldorf, Germany.
ACE’s AccuWrap Simplifies Multiple Sequential Laminations with Blind Vias
At DesignCon 2018, I spoke with James Hofer, general manager for Accurate Circuit Engineering, a quick-turn fabricator based in Santa Ana, California. James gave me a preview of AccuWrap, a new type of processing technology that lets designers reduce the amount of copper during sequential laminations while still meeting IPC specs, which should be of great interest to RF designers.
Show & Tell: IPC APEX EXPO 2018 is on the Books!
I-Connect007's Happy Holden reviewed the recently concluded IPC APEX EXPO 2018. Among the highlights: Less than 10% of all new orders arrive at the PCB fabricator’s facility with complete, accurate design data. Most have missing or incorrect data.
Show & Tell: IPC Awards—Rewarding Tireless Efforts for the Good of the Industry
Every year IPC presents dozens of awards to committee members for their work completing standards and specifications and for other activities within the organization. However, a few awards are extra special and presented for extraordinary efforts, for long-time commitment to both IPC and the electronics industry.
SHOW & TELL: Bringing STEM Students to IPC APEX EXPO for a View of the Industry
On the last morning of IPC APEX EXPO 2018, we met with Nancy Jaster, IPC design programs manager and one of the driving forces behind IPC’s STEM Outreach program for high school students. We spoke about the students who were arriving on site at IPC APEX EXPO, and what the industry, and IPC, hoped to achieve with this valuable program.
Setting the Record Straight: CEO Asher Levy on the Future of Orbotech
With the recent planned acquisition of Orbotech in place by maker KLA-Tencor, much of the industry has speculated about Orbotech’s future. Barry Matties spoke with CEO Asher Levy about what lies in store for the Orbotech group and, more specifically, their PCB division should the deal close.
Succeeding at the Velocity of Technology: An IPC APEX EXPO 2018 Wrap-Up
After many months of planning, IPC APEX EXPO 2018 proved to be a success. From revolutionary advancements displayed on the show floor to expert insights conveyed in technical conference sessions and professional development courses, IPC APEX EXPO provided the learning and connections that helped 4,574 attendees from 43 countries prepare for the future.
IPC 6012-DA Revisions: The Approach to Cleanliness, Thickness, Inspection, and Wicking
IPC’s Automotive Addendum task group was started in November 2014 and the first edition of IPC 6012-DA was released in April 2016. We are now working on the revised version, and expect a release in Q2 2018. As standards need to evolve, develop and follow the needs of the industry, this work is continuous.
Conversations on the Floor: IPC APEX EXPO 2018
This year’s show was one of the best in recent history, both in attendance and enthusiasm. The exhibit floor was sold out, and every single person I talked to was extremely optimistic about business in 2018. What follows are a series of observations and excerpts from conversations I had with some of the most interesting people I met.
PCB Manufacturing (R)evolution in the Making
At the recent HKPCA and IPC Show 2017 in Shenzhen, China, I was able to interview Les Sainsbury, CEO, and Andrew Kelley, CTO, of XACT PCB, as well as Alex Stepinski, vice president of Whelen Engineering’s PCB Fab Business Unit, to discuss process evolution and technology developments in the PCB manufacturing industry.
Show & Tell: IPC APEX EXPO 2018 Opening Keynote Review
The first keynote speech of IPC APEX EXPO 2018 was presented by Jared Cohen, head of Google’s Jigsaw team of engineers, researchers, and geopolitical experts. He explained that Jigsaw builds products not only to tackle global security challenges, but also to support free expression and access to information, especially in repressive societies.
What Happens to Our Industry Without a Skilled Workforce?
I’d like to discuss a critical issue facing our industry – the skills gap – and IPC’s commitment to supporting its members as we collectively seek to find solutions.
Weiner’s World—March 2018
SEMICON China 2018 was amazing in its size and attendance. More than 1,000 exhibitors filled an event record of more than 74,000 square meters of exhibition space—the size of nearly 10 professional soccer fields. This year's theme was "collect, collaborate, innovate."
RTW IPC APEX EXPO: Arlon Achieves IPC Validation Services Accreditation
John Wright, quality manager at Arlon Electronic Materials, discusses how the company recently achieved IPC validation services accreditation.
RTW IPC APEX EXPO: IPC Solutions Program—Transportation and Workforce Development Initiatives
Sanjay Huprikar, IPC's VP of solutions, discusses the IPC solutions program, including transportation and workforce development initiatives.
RTW IPC APEX EXPO: Bowman—XRF Equipment, New IPC 4552A Spec, and How They Go to Market
Tom Leone, president, and Zach Dismukes, sales and support engineer from Bowman, discuss their XRF equipment, the new IPC 4552A spec, and how they go to market.
Institute of Circuit Technology Meriden Seminar, 2018
The Institute of Circuit Technology returned to Meriden, traditionally regarded as the centre of England, for its Annual General Meeting, which was followed by a technical seminar of five presentations, introduced as ever by Technical Director Bill Wilkie.
RTW IPC APEX EXPO: IPC—Industry Trends Moving Forward
Sharon Starr, director of market research for the IPC, discusses industry trends moving forward covering both EMS and PCB. She also mentions the upcoming studies IPC will be conducting in 2018.
Bridging Knowledge and Understanding of Thermal Management Materials
At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.
Still Using 1980s Formats for Design Data Handoff?
The IPC-2581 format was created in the early 2000s with the merger of two competing formats: ODB++ and GENCAM. The new format, the brainchild of the late Dieter Bergman, languished with no adoption until 2011, when a small group of companies created the IPC-2581 Consortium with the goal of getting this open, neutral and intelligent format adopted. The consortium has been growing steadily in recent years. Its membership now includes more than 100 associate members in addition to its more than 90 corporate members.
RTW IPC APEX EXPO: Annual Update for IPC Validation Services
Randy Cherry, director of validation services, provides an annual update for IPC validation services, including QML and QPL supplier listings.
The Time is Right in India
In an interview with Akshinthala Vijayendra of IPC India, he discusses India’s infrastructure under the direction of the new prime minister, where India currently stands versus China, and the pros and cons for any speculative companies deciding whether to expand into this country.
New Year, New Equipment—Right?
This month, we will discuss the equipment purchasing decision-making process. How many of you can recall the earliest “dippy dunk” PCB shops, so-called because that’s exactly how it was done? There were no conveyorized lines, no automatic hoists, no load/unload stations, maybe not even a lab for analyzing the plating baths.
Part 2: EIPC’s Winter Conference in Lyon, France: Day 2 Review
The final session, on European needs for new technology, product safety and training, was introduced and moderated by EIPC board member Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group.
Blue Sky for Eagle Electronics
I recently had the opportunity to chat with the new director of sales and marketing at Eagle Electronics, Andy D’Agostino. I’ve visited Eagle before; they are endlessly busy, with good things going on, so I was happy when I learned that Brett McCoy was now COO and another fellow had taken over some of the sales and marketing activities. Andy comes with a wealth of experience and seems to have settled in nicely.
Start Your IPC APEX EXPO Show Experience Here
As many prepare to travel to California from February 24 to March 1, IPC APEX EXPO 2018 will offer a collection of exciting events for both newcomers and industry veterans, including educational opportunities and showcase exhibitions. Want a sneak peek into the upcoming events at IPC APEX EXPO 2018? This exclusive pre-show coverage publication from I-Connect007 is all about San Diego or bust!
Orbotech’s Strategic Decision for End-to-End Partnership Benefits Everyone
Barry Matties met with Sharon Cohen, president of Orbotech West, at productronica 2017 to discuss what’s new at Orbotech, specifically their shift to be more customer-centric and to provide regional coverage across the globe. He also discusses the current trends in the marketplace and Industry 4.0.
CircuitData: Creating an Open Source Language for PCB Data Exchange
I recently had the opportunity to speak with Elmatica CTO Andreas Lydersen on a subject of great interest to him and his supply chain, namely CircuitData. This open source language promises to greatly improve communication of details that can often be misinterpreted due to the differences in terminology used throughout the supply chain.
Who Really Owns the PCB Layout? Part 2
In Part 1 of this series, Paul Taubman made the bold statement that the PCB layout is just as much a mechanical effort as it is an electrical one. In Part 2, he threads the needle, explaining why he believes that a PCB truly a mechatronic design, and why mechanical engineers may be more prepared to take on the PCB layout.
CFX: Updates and Developments
In an interview with I-Connect007, she discusses the latest developments in the Connected Factory Initiative (CFX), the machine data interface standard that would enable manufacturers, equipment, device and software suppliers to achieve Industry 4.0 benefits, and CFX demos at IPC APEX EXPO 2018.
All the Details on IPC’s Emerging Engineer Program
Teresa Rowe and Nancy Jaster, in charge of IPC’s Emerging Engineer Program, explain to I-Connect007’s Patty Goldman and Jonathan Zinski how this novel approach to attracting and supporting young people works.
Solder Limits: Updates for the Age of Surface Mount
Solder limits are one of the fundamental parameters used when evaluating the PCB, solder resists, and metal-clad base materials for safety under the UL Recognition programme.
IPC APEX EXPO: App is Where It’s At
In an interview with I-Connect007, IPC Exhibits Manager Kim DiCianni discusses the IPC APEX EXPO 2018 app and how this powerful tool will keep attendees on track. She also highlights its usefulness for exhibitors.
The Best It’s Ever Been, Every Year: The Goal for IPC, Part 2
In the continuation of this interview, John Mitchell and Phil Carmichael discuss the areas of focus for IPC in the upcoming year, first and foremost being education and welcoming a new generation into the industry.
The Best It’s Ever Been, Every Year: The Goal for IPC, Part 1
The end of 2017 caps an exciting time for IPC and IPC China as membership has grown substantially, in part because of new offerings from the organization to its Asian members. Meeting with Barry Matties at HKPCA, John Mitchell and Phil Carmichael discuss the areas of focus for IPC in the upcoming year, first and foremost being education and welcoming a new generation into the industry.
A Sneak-Peek at IPC APEX EXPO 2018
IPC President and CEO John Mitchell gave I-Connect007 a sneak-peek at the upcoming IPC APEX EXPO, happening in February in San Diego. Mitchell provides a description of this year’s keynote, as well as a few new additions and areas of emphasis. It looks like it will be another packed house, with plenty to see, do, and learn about.
Riding the Tsunami of Success in Asia
Since Phil Carmichael has overseen IPC Asia, the program and its membership have grown substantially, and with good reason. Phil met with Barry Matties at HKPCA to discuss how IPC offerings such as the QML program and helping suppliers become CSR compliant has allowed IPC to become a vital resource for suppliers in Asia.
Thermal Management Update with Doug Brooks
I had the opportunity to talk with our contributor Doug Brooks recently. He has been doing some research on temperature effects on PCB traces over the last few years, and I wanted to check the status of his latest thermal efforts. He discussed his work with Dr. Johannes Adam, why temperature charts based on a trace in isolation are inaccurate, and how the industry remained so wrong about PCB temperatures for so long.
In Terms of Experience, a 10,000-foot View of China
In the past 30+ years of PCB manufacturing in China, you would be hard-pressed to find someone more connected to the pulse of the Asian market than Gene Weiner. Barry Matties met with the industry veteran at HKPCA to get his take on the show, the current and future market conditions of China, and any effect the new U.S. administration might have on trade relations going forward.
Mike Jouppi Discusses his Drive for Better Thermal Data
If you mention thermal management in a group of PCB designers and design engineers, Mike Jouppi’s name usually pops up. Mike is an engineer and founder of the Thermal Management LLC consulting firm. He spent years updating IPC’s charts on current-carrying capacity, which had been unchanged since the 1950s. I recently caught up with Mike and asked him to give us his views on the state of thermal management, as well as the tools and standards related to thermal design.
Weiner’s World—December 2017
Hold on to your seats! 2018 will be a year full of rapid changes, surprises, and growth. M&A activities will flourish. The supply chain will suffer shortages and changes as demand increases, copycats will rush to market, and new markets and potential suppliers will vanish before they are established.
AGFA: From Film to Inkjet Solder Mask
The productronica show was indeed filled with new technology, and it was great to meet with people and learn about it. This is precisely how I met AGFA’s Frank Louwet, who filled me in on the Dipamat inkjet solder mask they have been developing. It seemed an odd choice to go from film to solder mask, but as Frank explained, it makes perfect sense.
Institute of Circuit Technology Harrogate Seminar 2017
A return to the historic spa town of Harrogate in Yorkshire, England for the Institute of Circuit Technology Northern Seminar, to enjoy a diverse programme of presentations on safety standards, research in selective metal deposition, and developments in imaging and inspection techniques.
RTW…HKPCA & IPC Show 2017 Highlights With Canice Chung
Canice Chung, chairman of the HKPCA, speaks with Managing Editor Stephen Las Marias about the record-breaking show, held this week in Shenzhen, China.
RTW HKPCA & IPC Show 2017: IPC Asia’s Philip Carmichael on the Changes in PCB Value Chain
During the 2017 International Printed Circuit & APEX South China Fair (HKPCA & IPC Show 2017) in Shenzhen, IPC Asia President Philip S. Carmichael speaks with I-Connect007 Managing Editor Stephen Las Marias about the move in the value chain that’s driving the electronics manufacturing industry forward.
A Conversation with EIPC Executive Director Kirsten Smit-Westenberg
The EIPC booth was a busy place during productronica, with several members and other organizations headquartered there, resulting in a constant stream of people stopping by to visit, get information and study the upcoming conference agendas. Overseeing the big, and even the little things, was Executive Director Kirsten Smit-Westenberg, who made sure important questions got answered, people stayed hydrated, and EIPC’s magnetic pins found homes on shirt collars.
The PCB Norsemen: Industry 4.0, AI and CircuitData
As automation works its way onto the shop floors, it still struggles to replace humans in the supporting roles, such as designers, purchasers, brokers, and back-office staff. Where automation on the shop floor replaces humans in doing repetitive manual tasks, the supporting roles (at least some of them) require intelligence to understand and utilise information.
Final Finishes: Taking Gold Thickness into Account
Martin Bunce was one of several people from MacDermid Enthone who presented at SMTA International this year. He sat down with me for a chat about his paper on final finishes, particularly with regard to controlling gold thickness.
A Guide to IPC Survey and Report Season
IPC Director of Market Research Sharon Starr found time to discuss the recently conducted and published surveys and research reports and a few others still in the works. These reports are free to survey participants, which is certainly a great incentive for taking the time to complete them. (Hint: That’s a call to action for those of you sitting on the sidelines.)
IPC Status Update: Training, Standards, and More!
At the recent IPC Fall committee meetings that are co-located with the SMTA International conference and show, IPC’s president and CEO, John Mitchell, sat down for a chat with me for an update on what’s happening at IPC.
Update on IPC’s Validation Services and Hints of What’s to Come
SMTA International is the perfect time to get updates on IPC happenings. One that I’m always curious about is the Validation Services programs. At the busy show, I managed to find a quiet spot so Randy Cherry, IPC’s director of Validation Services, could fill me in on the latest.
Patty's Perspective: (Signal) Integrity for All
Our topic this month is signal integrity, certainly a common one in our industry. Signal integrity is achieved by controlling impedance, so my advice is to do that. There, I’m done. Just kidding…of course I’m not done. But if you are in PCB manufacturing and you think this is just a design problem and doesn’t concern you, please think again.
Institute of Circuit Technology Hayling Island Seminar 2017
This year’s event had a well-chosen and varied programme featuring presentations on process chemistry and R&D consortia, a discussion of controversial standards proposals and a review of the experiences of commissioning new technology in a start-up factory.
Weiner’s World—August 2017
IPC is planning to hold a special meeting on automotive electronics for senior executives during IPC APEX EXPO 2019. The meeting will be planned and produced by the IPC Ambassador Council. Its presentations will feature senior members of the entire automotive electronics supply chain.
Hamed El-Abd: A New Beginning, Part 1
While in China recently, Barry Matties joined longtime I-Connect007 friend and contributor Hamed El-Abd of WKK to congratulate him on his upcoming retirement. They reflected on his time spent in the industry, specifically in China, how far it’s come, and where it might be headed next.
IMPACT Interview: Joe O’Neil, OAA Ventures
At the recent IMPACT Washington D.C. 2017, I-Connect007 Managing Editor Patty Goldman caught up with Joe O’Neil of OAA Ventures to talk about the event. As a veteran of many IMPACT meetings, his was a good perspective of the event.
Stephen V. Chavez Talks Mil/Aero PCB Design
Stephen V. Chavez, CID+, is the lead PCB designer for the Electronic Systems Center division of UTC Aerospace Systems (UTAS), a military contractor that builds all manner of cutting-edge tools for the American warfigher. He’s been designing military and aerospace PCBs for decades, and he’s a veteran of the United States Marine Corps. I caught up with Steph and asked for his thoughts on designing PCBs for the military and aerospace markets.
IMPACT Interview: Fern Abrams, IPC
At the recent IMPACT Washington D.C. 2017 event, I-Connect007's Patty Goldman speaks with IPC's Fern Abrams to get the inside story on the meeting with EPA.
IMPACT Interview: Anaya Vardya, American Standard Circuits
I-Connect007's Patty Goldman spoke with Anaya Vardya, president and CEO of American Standard Circuits, a few days after the conclusion of IMPACT, especially wanted his views as a first-timer there.
PCB Designers Notebook: Embedding Components, Part 2
Technology and processes for embedding capacitor and inductor elements rely on several unique methodologies. Regarding providing capacitor functions, IPC-4821 defines two methodologies for forming capacitor elements within the PCB structure: laminate-based (copper-dielectric-copper) or planar process and non-laminate process using deposited dielectric materials.
IPC: Department of Labor Releases RFI to Seek Information on Overtime Regulations
This week, the Department of Labor (DOL) released a Request for Information (RFI) to gather additional feedback from the public on the overtime regulations, which define and delimit exemptions from the Fair Labor Standards Act’s minimum wage and overtime requirements for certain executive, administrative, professional, outside sales and other employees.
Review of the 2017 IPC Reliability Forum
IPC continues to lead our industry by example with their inaugural Reliability Forum, held in Chicago in April. The event was focused on manufacturing high-performance products and featured industry royalty from both a speaker and audience standpoint.
The Skills Gap – Meet People Where They Are!
A perennial concern in the U.S. electronics manufacturing industry is the lack of skilled talent in many parts of the country. According to a recent IPC member survey, most companies have a hard time recruiting qualified production workers, engineers, and other technical professionals.
Patty's Perspective: What Happens in Washington Doesn’t Stay in Washington—It Reaches All of Us
I went to my second IMPACT Washington, D.C. event this year (May 1–3) and, as much as I applauded last year’s event, this one far surpassed it—just ask anyone who was there. In this month’s issue, a special section on IMPACT backs that claim.
Mr. Laminate Tells All: PTFE is About to be Banned by IEC TC111
There, I said it. Technical Committee 111 of the International Electrotechnical Commission (IEC) is preparing to effectively ban PTFE (polytetrafluoroethylene) materials from electronics. As history goes, the electronics industry has focused on only two of the four halogens (bromine and chlorine) to be limited in order to be called “halogen-free” or more accurately “low-halogen.” But now, fluorine is being dragged down too, just because of its location in the periodic table.
Weiner’s World – June 2017
On the way back from Hong Kong last week I had the good fortune of meeting an officer of Allegro Microsystems and enjoyed a wide ranging discussion with him. One of the "take home" items was concern about an expanding shortage of rare earth metals used to make ICs for the burgeoning automotive sensor market. The second was how important the roles of partnering and consortia are in the rapidly advancing autonomous automotive electronic field.
Better Together: How HDP User Group Showcases the Industry’s Best Side
HDPUG is a non-profit trade organization comprised of members from top companies in the electronics industry, from materials suppliers and manufacturers, to OEMs and end users. Key activities include collaborating on issues facing multiple industries and bringing people together on projects who might not have met otherwise. Barry Matties met HDPUG’s European representative and project facilitator Alun Morgan at the recent EIPC Summer Conference to learn more about the group and current projects.
14th Electronic Circuits World Convention
The 14th Electronic Circuits World Convention (ECWC14) started in Seoul to the usual fanfare after the opening ceremonies of KPCA 2017. The ribbon-cutting ceremony was conducted by KPCA’s Jung Bong Hong and the representatives of the other WECC members: WECC Secretary General Rex Rozario; Jin Zhangi (CPCA); Alun Morgan (EIPC); Vikram Desai (Electronic Industries Association of India); Canice Chung (Hong Kong PCA); David Bergman (IPC); Kushal Patel (IPCA); Toshifumi Kobayashi (JPCA), and Rich Wu (TPCA).
President Donald Trump Launches Workforce Development Week
Earlier this week President Donald Trump announced “Workforce Development Week.” As such, President Trump spent the last four days promoting job creation and even signed executive order expanding apprenticeship programs.
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 2
The second day saw the conference room full once more, the late networking session in the bar having resulted in no significant casualties, and I was pleased to accept the invitation to moderate the first session, on processes and materials for flexible PCBs.
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