Just Ask Happy: The Future of Mechanical Blind, Buried Vias

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We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

Q: Do mechanical blind and buried vias have a future?

A: Yes, especially for the newly invented VeCS technology, which uses a mechanical drill to gain the same density as laser-drilled microvias, but with higher reliability. For more information, read this series on VeCS technology by Joan Tourné of NextGin Technology, which ran in PCB007 Magazine in 2019 (also read Part 2, Part 3, and Part 4).

To pose your own question for Happy Holden, take the survey by clicking here.

06/30/2020 | I-Connect007 Editorial Team

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

06/04/2020 | Pete Starkey, I-Connect007

The emerging trend for “electronics on everything, everything with electronics” was the theme of iNEMI’s webinar presentation of the highlights of its recently published Flexible Hybrid Electronics Roadmap Chapter, delivered by Girish Wable, senior engineering services manager with Jabil. Pete Starkey provides an overview.

05/01/2020 | Pete Starkey, I-Connect007

In an informative and enlightening webinar, iNEMI Project Manager Steve Payne was joined by Isola Group CTO Ed Kelley to explain, review, and discuss the details of the recently published “iNEMI 2019 Roadmap for Organic PCBs.” Pete Starkey provides an overview.